About IMAPS DPC 2018The 14th Annual Device Packaging Conference (DPC 2018) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. For more information visit www.imaps.org/devicepackaging/. About IWLPC IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging. Going into its 15th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals. The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing and test. Professional development courses, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATS, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies. The 15th Annual Conference will be held October 23-25, 2018 in San Jose, CA.
For more information visit: www.iwlpc.com.About Intevac Intevac was founded in 1991 and has two businesses: Thin-film Equipment and Photonics. In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently. In our Photonics business, we are a recognized leading developer of advanced high-sensitivity digital sensors, cameras and systems that primarily serve the defense industry. We are the provider of integrated digital imaging systems for most U.S. military night vision programs. For more information call 408-986-9888, or visit the Company's website at www.intevac.com.