Advanced Semiconductor Engineering, Inc (ASE, TAIEX: 2311, NYSE: ASX), the leading provider of semiconductor assembly and test services, today announced that it has once again been included in the 2017 Dow Jones Sustainability Indices (DJSI) World and the Emerging Market segments. For the second year in a row, ASE was also named the sector leader in the Semiconductors and Semiconductor Equipment Industry Group, one of 24 groups represented on the DJSI. In the Semiconductors and Semiconductor Equipment Industry group, a total of 49 large publicly listed companies were included in the assessment and only 5 companies made the 2017 DJSI World list. ASE is the only outsourced semiconductor assembly and test service provider to be included as an index component and also recognized as the semiconductor industry leader with strong ESG (environmental, social and governance) performance. The inclusion of ASE as a component in the DJSI World is an endorsement of the positive impact of the company's actions to manage economic, social and environmental challenges while maintaining technology innovation and long term growth. The DJSI is the gold standard for corporate sustainability and a key reference point for investors and stakeholders worldwide. The DJSI World was launched in 1999 and is the first global index to track the leading sustainability-driven companies based on RobecoSAM's analysis of financially material Environmental, Social, and Governance (ESG) factors and S&P DJI's robust index methodology. RobecoSAM assesses the world's largest companies through its annual Corporate Sustainability Assessment (CSA), which uses a consistent, rules-based methodology to convert an average of 600 data points per company into one overall score that ultimately determines inclusion in the DJSI. For more information on the Dow Jones Sustainability Indices, please visit http://www.robecosam.com/en/sustainability-insights/about-sustainability/corporate-sustainability-assessment/review.jsp For more information on ASE's corporate sustainability, please visit http://www.aseglobal.com/en/Csr/ About The ASE Group The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com or twitter @asegroup_global. Safe Harbor Notice This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties as to whether we can complete the share exchange contemplated by a joint share exchange agreement between Siliconware Precision Industries Co., Ltd. and us; the strained relationship between the Republic of China and the People's Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2016 Annual Report on Form 20-F filed on April 21, 2017.