- Micro-actuators, micro-pumps, sensors, and energy scavengers integrated on silicon-based MEMS using piezoelectric thin-films (PZT), for applications in Data Storage, Printing, Health Care, Automotive, Energy Scavenging, and Autofocus Lenses.
- Magnetic-field sensors, for applications in consumer applications such as GPS positioning, indoor navigation, and mobile phones.
- Advanced packaging technologies and vertical interconnections, including flip chip, Through Silicon Via (TSV) or Through Mold Via (TMV) for full 3D integration, which could be used in Consumer and Healthcare applications such as body-area sensors and remote monitoring.
Press Information Contact for the Project Coordinator:STMicroelectronics Michael Markowitz Director of Technical Media Relations +1 781 591 0354 email@example.com  The total cost of the project - € 28.2 million - was supported in part by funding from the ECSEL Joint Undertaking and by contributions from each of the respective National agencies: Italy, France, Malta, The Netherlands, Finland, Belgium, Poland, Norway, Austria, Romania. Attachments: http://www.globenewswire.com/NewsRoom/AttachmentNg/3528fc98-9526-43e9-9fc7-552845234a49 Attachments: A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/58bc7ac2-94f2-4219-b124-e313a3235239