SALT LAKE CITY, Nov. 18, 2016 /PRNewswire/ -- Huawei launched a new-generation high-performance computing (HPC) platform, the FusionServer X6000, at the Supercomputing Conference 2016 (SC16).
This FusionServer X6000 will aid computing-intensive workloads and provide enterprise customers with an ideal choice for an HPC platform that has higher efficiency and greater flexibility. "Faced with the challenges of digital transformation, enterprises are eager for service reconstruction, which drives the convergence of traditional HPC and cutting-edge technologies such as cloud computing and Big Data," said William Dong, Vice President of Data Center Solution Sales, Huawei Enterprise BG. "With outstanding R&D capabilities and comprehensive product portfolios in the IT domain, Huawei joins hands with industry partners to build joint innovation centers around the globe. We are dedicated to providing our customers IT infrastructures with leading technologies, as well as innovative HPC cloud, HPC, and Big Data solutions to help customers achieve business success." The X6000 HPC platform adopts an industry-leading and innovative liquid cooling solution, which features a skive fin micro-channel heat sink for CPU heat dissipation and processing technology where water flows through memory modules. The platform delivers a node liquid cooling percentage greater than 85%. Its modular design and 50ºC warm water cooling function offers customers high energy-efficiency and flexible deployment, and reduces total cost of ownership (TCO) by up to 40% for large-scale deployment. The platform also accommodates four 2-socket server nodes in a 2U chassis and presents an outstanding all-flash storage capability of 24x NVMe SSDs per chassis. Based on the high bandwidth and low latency features of 100 Gbps networks, the X6000 HPC platform can achieve a single-node throughput of 4.8 million IOPS.