Acacia Communications Recognized In Fierce Innovation Awards

MAYNARD, Mass., Nov. 18, 2016 (GLOBE NEWSWIRE) -- Acacia Communications, Inc. (NASDAQ:ACIA), a leading provider of high-speed coherent optical interconnect products, today announced that its CFP-DCO module has been named the winner in the Core Networking category in this year's Fierce Innovation Awards: Telecom Edition, a carrier-reviewed awards program from the publisher of FierceWireless, FierceTelecom  and FierceCable

Finalists' applications were reviewed by an exclusive panel of executives from major telecommunications companies including Verizon, TeliaSonera, Comcast, Sprint, and T-Mobile. Full profiles of the judges can be found at https://www.fierceinnovationawards.com/telecom/2016#our_judges. All applications were evaluated based on effectiveness, ease of use, return on investment, true innovation and end-user impact.

Introduced in 2014, Acacia's CFP-DCO module is a pluggable coherent optical interconnect solution based on Acacia's low-power Sky DSP ASIC. Acacia's CFP-DCO, which incorporates its internally developed silicon photonic integrated circuit (PIC) technology, is easily integrated into customers' existing network equipment. Initially, introduced for metro applications, Acacia recently announced a long haul version of its CFP-DCO. 

"We are honored to have our CFP-DCO module recognized by an impressive panel of industry experts as a winner of a Fierce Innovation Award," said Bhupen Shah, Vice President of Engineering for Acacia Communications. "We take great pride in the pace of innovation that our team has been able to achieve and believe this provides real value to our customers."

On November 7th, Acacia announced sampling of its CFP2-DCO module. Acacia's CFP2-DCO module incorporates Acacia's new lower power digital signal processor (DSP) ASIC based on 16nm CMOS technology. The CFP2-DCO module offers a pluggable solution with four times the faceplate capacity of the CFP-DCO module. This capacity increase is achieved by reducing the width of the module by a factor of two and doubling the maximum data transmission rate from 100 Gbps to 200 Gbps.

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