Asian stock markets were mixed on Tuesday, while U.S. bond prices recovered.

U.S. futures moved higher, with the Nasdaq 100 up 0.06% after a technology selloff on Monday, Dow Jones futures up 0.05% and S&P 500 futures up 0.17%.

In Japan the Nikkei 225 closed down 0.03% 17,668.15 and the Topix rose 0.21% to 1,402.98. Leading banks Mitsubishi UFJ Financial and Sumitomo Mitsui Financial were among the main gainers, both rising about 4%.

In Hong Kong the Hang Seng was up 0.29% at 22,287.50, led by banks, insurers and real estate companies.

On mainland China the CSI 300 was down 0.01% at 3,429.87.

In Seoul the Kospi fell 0.35% to 1,967.53.

Samsung Electronics (SSNLF) dropped 0.9% after announcing its $8 billion deal for automotive specialist Harman (HAR) after markets closed on Monday.

In Sydney the S&P ASX 200 closed down 0.36% at 5, 326.20. Miners slipped, with BHP Billiton (BHP) down 1.2%.

The dollar was recently down 0.08% against the yen at 108.33.

Brent crude was up 1.58% at $45.13 per barrel, while the spot gold price rose 0.43% to $1,226.65 an ounce. The yield on the 10-year U.S. Treasury bond was recently down 6 basis points at 2.20%. The yield has risen 41 basis points in the past month.