FREMONT, Calif., Nov. 14, 2016 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ:AEHR) , a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will be showcasing its FOX-XP System, its next generation multi-wafer test and burn-in system for high volume production and early failure rate (EFR) test at the 2016 International Test Conference (ITC) taking place November 15-17 in Fort Worth, Texas at the Fort Worth Convention Center (Booth #318). Aehr Test's FOX-XP system is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, optical devices, laser diodes, VCSELs, LEDs and other leading-edge ICs in wafer form before they are assembled into multi-die packages or other applications where known good die are critical. These end applications can span enterprise solid state drives, automotive devices, highly valuable mobile applications, communications and mission critical integrated circuits and sensors. The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 slots of wafer test resources enabling up to 18 wafers to be tested simultaneously. It also includes Aehr's proprietary WaferPak full wafer contactor, which enables meeting the very high pin count and small pad size and pad pitch requirements of today's devices, and Aehr's high performance thermal chucks that enable managing the temperature of the high power density of the devices on the wafer. The footprint of the 18 wafer test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time.