The Silicon Labs BGM12x SiP Module Enables The Industry's Smallest Bluetooth Module Footprint. (Graphic: Business Wire)

Silicon Labs (NASDAQ: SLAB) has introduced the industry's smallest Bluetooth® low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB footprint including the antenna clearance area to 51 mm 2. Applications for this ultra-small, high-performance Bluetooth module include sports and fitness wearables, smartwatches, personal medical devices, wireless sensor nodes and other space-constrained connected devices.

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The Silicon Labs BGM12x SiP module enables the industry's smallest Bluetooth module footprint. (Grap ...

The Silicon Labs BGM12x SiP module enables the industry's smallest Bluetooth module footprint. (Graphic: Business Wire)

For details about Silicon Labs' BGM12x Blue Gecko SiP module including pricing and availability, the Bluetooth 4.2 stack, development tools and data sheets, visit www.silabs.com/bgm12x . Silicon Labs is unveiling the new BGM12x SiP module today with an innovative heart-rate monitoring wearable demonstration at Booth A4.212 at electronica.

Based on Silicon Labs' Blue Gecko wireless SoC, the BGM12x module provides an all-in-one Bluetooth connectivity solution featuring an ARM® Cortex®-M4 processor, high-output Bluetooth power amplifier, high-efficiency onboard antenna, external antenna options, oscillators and passives, along with a reliable, secure Bluetooth 4.2 stack and best-in-class development tools. The BGM12x module's high level of SiP integration frees developers from the complexities of RF system engineering, protocol decisions and antenna design so that they can focus on their end applications. The module's exceptionally small size makes it easy to use in space-sensitive, battery-powered applications including low-cost, two-layer PCB designs.

"Small size is as critical to IoT end node design as ultra-low power, low system cost and high levels of integration," said Daniel Cooley, Senior Vice President and General Manager of IoT Products at Silicon Labs. "Great things really do come in small packages, and there's nothing quite like the BGM12x module in the Bluetooth low energy market. The BGM12x SiP module enables developers to design compact Bluetooth designs quickly and easily by integrating all required hardware and software components including a Bluetooth 4.2 compliant stack."

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