Derma Sciences, Inc. (Nasdaq: DSCI), a tissue regeneration company focused on advanced wound and burn care, announced today that it will hold a conference call on November 10, 2016 to discuss the financial results for the third quarter of 2016. In addition, management will provide a business update and a discussion on recent and upcoming milestones.

The conference call is scheduled to begin at 11:00 a.m. (Eastern Time). The results will be released before the opening of the market that same day.

To access the conference call, U.S.-based listeners should dial 888-563-6275 and international listeners should dial 706-634-7417. All listeners should provide the following passcode: 11970991. Individuals interested in listening to the live conference call via the Internet may do so by logging on to the Company's website at

Following the conclusion of the conference call, a replay will be available through November 16, 2016 and can be accessed by dialing (855) 859-2056 from within the U.S. or (404) 537-3406 from outside the U.S. All listeners should provide passcode 11970991. The webcast will be available for 30 days.

About Derma Sciences, Inc.

Derma Sciences is a tissue regeneration company focused on patent-protected and proprietary advanced wound and burn care treatments. The Company's lead products include TCC-EZ®, a gold-standard total contact casting system for diabetic foot ulcers, and its MEDIHONEY® product line, the leading brand of honey-based dressings for the management of wounds and burns. It is also engaged in the development and commercialization of novel proprietary regenerative products derived from placental/birth tissues for use in a broad range of clinical applications including the treatment of complex chronic wounds, acute wounds and localized areas of injury or inflammation, in addition to filling soft tissue defects or voids. These products are used in orthopedic, spinal and ocular surgical procedures, among others. The Company also offers a full product line of traditional dressings. For more information, please visit

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