United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has verified on silicon its 0.18um Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive ICs. The process is now ready for mass production, with qualified FDK and IP available for automotive applications such as power management IC (PMIC). The successful qualification enables UMC manufactured chips to be used for high-reliability vehicle applications within high temperature environments, and follows upon the foundry's successful mass production of AEC-Q100 Grade-1 automotive ICs. "Semiconductor content in vehicles continues to increase at a rapid pace as auto electronics such as ADAS, infotainment and navigation constantly evolve," said SC Chien, senior vice president and head of corporate marketing at UMC. "More recently, higher expectations for emission reduction & energy efficiency have driven the demand for more advanced power electronics technology and components, which require the most stringent AEC-Q100 Grade-0 manufacturing to meet high temperature, zero-defect requirements. With our 0.18um BCD process, UMC is one of the only foundries compliant with AEC-Q100 Grade 1 & 0 semiconductor production specifications, and we look forward to helping more foundry customers gain entry into the thriving automotive IC market." UMC has a successful history as an automotive IC supplier, being the first foundry to receive ISO 22301 certification for business continuity management. The foundry implements a comprehensive "Automotive Service Package" that incorporates zero-defect manufacturing practices to help customers meet automotive quality requirements. In addition, UMC offers comprehensive Grade-0 IP including standard library, SRAM and OTP/MTP/eFuse that have been silicon verified in automotive IC products. ICs manufactured at UMC have been widely adopted by the world's most well-known carmakers in Japan, Europe, Asia and the United States. About UMC UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry's highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICs found in cars. UMC's 10 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs more than 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com Note from UMC Concerning Forward-Looking Statements Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.