Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, is offering free technical consulting on how plasma treatment systems reduce premature device failures in the field and details ways your company can improve its manufacturing process through plasma cleaning. Nordson MARCH experts will be at the DAGE Deutschland stand #6-314 at SMT Hybrid Packaging 2015, being held in Nuremberg, Germany from May 5-7, 2015. German translation available at: http://www.nordson.com/en-us/divisions/march/about-march/News/Documents/PR-SMT-Hybrid-Packaging-2015-German-NordsonMARCH.pdf Plasma treatment has long been recognized as a valuable process in the microelectronics and semiconductor packaging industries. The introduction of an appropriate plasma process prior to wire bonding will always deliver a cleaner surface to bond to. Potential benefits are improved wire bond statistics, improved device reliability, and the elimination of excursions caused by non-systemic influences such as random pollution of the surfaces to be bonded by uncontrolled factors. "Plasma has something of the aura of 'alchemy' or a 'black box'," explained John Maguire, business manager Europe, Nordson MARCH. "There are, nonetheless, realistic expectations about what plasma can contribute both to the performance of a wire bonding process and to the long-term reliability of the packaged device. The benefits of plasma are two-fold: improving the wire bonding process itself and ensuring the long-term reliability of the device. SMT Nuremberg attendees are invited to meet with me at the DAGE Deutschland stand #6-314 for a free consultation on how the quality and success of their manufacturing process and products can be enhanced greatly by plasma cleaning prior to wire bonding. Please contact me at email@example.com to set up an appointment or stop by the stand." You can access Nordson MARCH's white paper, Plasma Clean to Reduce Wire Bond Failures, in both English and German by clicking on http://www.nordson.com/en-us/divisions/march/solutions/semiconductor/ASPA/Pages/Plasma-Clean-to-Reduce-Wire-Bond-Failures-White-Paper.aspx. For more information, contact Nordson MARCH in Europe at +31 433524466, in the US at +1.925.827.1240, email firstname.lastname@example.org, or visit the website at www.nordsonmarch.com. Photo Available at: http://www.nordson.com/en-us/divisions/march/PublishingImages/High-Res/AP-300-600.png About Nordson MARCH Nordson MARCH is the global leader in plasma processing technology for the semiconductor, printed circuit board (PCB), microelectronics, and medical & life science device manufacturing industries. Nordson MARCH has offices and applications laboratories worldwide, including California, Europe, Singapore, China, Japan, Korea and Taiwan. With over 25 years of continuous innovation, Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma processing systems. An expert staff of scientists and engineers is available to assist in the development of plasma processes that improve product reliability and increase production yields. Visit Nordson MARCH on the web at www.nordsonmarch.com or Facebook or Google+. About Nordson Corporation Nordson engineers, manufactures and markets differentiated products and systems used for dispensing and processing adhesives, coatings, polymers, sealants and biomaterials; and for managing fluids, testing and inspecting for quality, treating surfaces and curing. These products are supported with extensive application expertise and direct global sales and service. We serve a wide variety of consumer non-durable, consumer durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
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