BUC, France and MIAMI, Nov. 13, 2014 (GLOBE NEWSWIRE) -- HEICO Corporation (NYSE:HEI.A) (NYSE:HEI) today reported that its 3D PLUS subsidiary supplied mission critical components on the European Space Agency's (ESA) Rosetta program which yesterday successfully landed a robotic probe on a comet for the first time in history.

Based in Buc, France, 3D PLUS supplied six identical micro-cameras which will be used to take 360 degree panoramic pictures of the comet's surface and one micro-DPU computer on the robotic probe called Philae, along with one micro-DPU computer and one micro-camera onboard the Rosetta spacecraft which carried Philae to the comet on a more than 10-year journey which began on March 2, 2004.

The analytical instruments aboard Philae were developed by IAS/Universite Paris-Sud and the instruments which 3D PLUS supplied on the Rosetta spacecraft were developed by the Max Planck Institute.  The devices supplied by 3D PLUS on the Rosetta spacecraft are involved in analyzing the characteristics of dust grains emitted by the comet.

Laurans A. Mendelson, HEICO's Chairman and Chief Executive Officer, along with Co-Presidents, Eric A. Mendelson and Victor H. Mendelson, commented, "Once again, our fellow HEICO Team Members have us overflowing with pride.  3D PLUS has repeatedly supplied successful and critical components on important space missions.  We congratulate the entire team at 3D PLUS, which is led by their talented CEO, Pierre Maurice, on this tremendous accomplishment.  We also congratulate ESA and all of its partners on the remarkable program which they expertly created and carried out."

HEICO Corporation is engaged primarily in the design, production, servicing and distribution of certain niche aviation, defense, space, medical, telecommunications and electronics products.  HEICO's customers include a majority of the world's airlines and overhaul shops as well as numerous defense and space contractors and military agencies worldwide in addition to medical, telecommunications and electronics equipment manufacturers.  For more information about HEICO, please visit our web site at http://www.heico.com.

About 3D PLUS:   3D PLUS ( http://www.3d-plus.com) is a world-leading supplier of advanced, high-density, three-dimensional micro-electronic products, along with Die and Wafer level stacking technology meeting the demands for high reliability, high performance and very small sized electronics.  3D PLUS primarily serves the space and medical industries.
CONTACT: Victor H. Mendelson (305) 374-1745 ext. 7590

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