Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) will promote its new TS9000 mold thickness analysis solutions at the International Microelectronics Assembly and Packaging Society conference in San Diego, October 13-16, 2014. The TS9000 is an innovative metrology tool that automates mold overlay thickness analysis for IC packaging by using non-destructive pulsed terahertz radiation. The TS9000 is part of the company’s family of compact and multipurpose terahertz spectroscopic / imaging systems. The TS9000 sets a new standard in the semiconductor industry with its ability to perform mold thickness analysis of IC packaging, previously difficult to measure using conventional metrology. This “first-in-class” system enables rapid, repeatable and highly accurate measurements, even when analyzing the optically opaque mold polymer materials typically employed in IC packages. The flexible system handles die in strip or singulated units and is also fully compatible with industry-standard JEDEC trays. Non-contact and non-destructive, it can be configured for partial or 100% inspection of the product. IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The conference will be held from October 13-16, 2014 at the Town and Country Resort and Conference Center in San Diego, CA. More information on IMAPS can be found at: http://www.imaps.org/imaps2014/index.htm About Advantest Corporation A world-class technology company, Advantest is a leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as a groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at www.advantest.com.