NEW YORK (TheStreet) –– Apple (AAPL) iPhone 6 and iPhone 6 Plus went on sale this morning to tens of thousands around the world, but investors have their eyes on what's inside the phone, as well as the phone itself.
NXP Semiconductors (NXPI) , which was expected to be a big beneficiary because of the inclusion of Near Field Communications and mobile payments, has two spots. It's bringing the NXP LPC18B1UK ARM Cortex-M3 Microcontroller (which is also the M8 motion coprocessor) and NXP 65V10 NFC module + Secure Element, which iFixit believes may include a NXP PN544 NFC controller.
There's also an NFC-related chip from AMS, the AMS AS3923 Boosted NFC Tag Front End.
Watch the video below for a look at the iPhone 6 and iPhone 6 Plus as they hit store shelves Friday:
There's also a few chips from Apple, including the Apple A8 APL1011 system-on-a-chip (SoC) and the Apple/Dialog 338S1251-AZ Power Management IC chip.
Of the Qualcomm chips, there's the Qualcomm MDM9625M LTE Modem, Qualcomm WTR1625L RF Transceiver, Qualcomm QFE1000 Envelope Tracking IC, Qualcomm WFR1620 receive-only companion chip and the Qualcomm PM8019 Power Management IC.