NEW YORK (TheStreet) –– Apple (AAPL) iPhone 6 and iPhone 6 Plus went on sale this morning to tens of thousands around the world, but investors have their eyes on what's inside the phone, as well as the phone itself.
NXP Semiconductors (NXPI) , which was expected to be a big beneficiary because of the inclusion of Near Field Communications and mobile payments, has two spots. It's bringing the NXP LPC18B1UK ARM Cortex-M3 Microcontroller (which is also the M8 motion coprocessor) and NXP 65V10 NFC module + Secure Element, which iFixit believes may include a NXP PN544 NFC controller.
There's also an NFC-related chip from AMS, the AMS AS3923 Boosted NFC Tag Front End.
Watch the video below for a look at the iPhone 6 and iPhone 6 Plus as they hit store shelves Friday:
There's also a few chips from Apple, including the Apple A8 APL1011 system-on-a-chip (SoC) and the Apple/Dialog 338S1251-AZ Power Management IC chip.
Of the Qualcomm chips, there's the Qualcomm MDM9625M LTE Modem, Qualcomm WTR1625L RF Transceiver, Qualcomm QFE1000 Envelope Tracking IC, Qualcomm WFR1620 receive-only companion chip and the Qualcomm PM8019 Power Management IC.
Avago is offering the Avago A8020 High Band PAD, Avago A8010 Ultra High Band PA + FBARs. Broadcom is supplying the BCM5976 Touchscreen Controller, while Texas Instruments (TXN) has its 343S0694 Touch Transmitter. Skyworks is supplying the Skyworks 77802-23 Low Band LTE PAD, SkyWorks 77803-20 Mid Band LTE PAD, SkyWorks 77356-8 Mid Band PAD. InvenSense INVN has the InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo.
Inside the iPhone 6 are other usual Apple partners, including RF Micro Devices (RFMD) , which has the RF Micro Devices RF5159 Antenna Switch Module, SanDisk (SNDK) , which is supplying the NAND Flash (16GB) with its SanDisk SDMFLBCB2 128 Gb, the Murata 339S0228 Wi-Fi Module, Cirrus Logic (CRUS) , which has the Cirrus Logic 338S1201 Audio Codec.
Read More: iPhone 5s Teardown: What's Inside
--Written by Chris Ciaccia in New York
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