SAN FRANCISCO, July 7, 2014 /PRNewswire/ -- Today at SEMICON West, KLA-Tencor Corporation (NASDAQ: KLAC) announced four new systems—the 2920 Series, Puma™ 9850, Surfscan® SP5 and eDR™-7110—that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 unpatterned wafer defect inspection systems deliver enhanced sensitivity and significant throughput gains. By enabling discovery and monitoring of yield-critical defects, these inspectors support chipmakers' integration of complex structures, novel materials and new processes at leading-edge design nodes. Each of the inspection systems seamlessly connects with the eDR-7110 electron-beam review system, which utilizes improved automatic defect classification capability to quickly identify detected defects, providing chipmakers with accurate information for determining corrective action. To view the multimedia assets associated with this release, please click: http://www.multivu.com/players/English/7065551-kla-tencor-introduces-inspection-review-portfolio-ic-technologies Logo - http://photos.prnewswire.com/prnh/20140123/SF50413LOGO "As our customers integrate many unique technologies at the 16nm, 14nm and smaller design nodes, they face complex yield and reliability challenges," said Bobby Bell, executive vice president of KLA-Tencor's Wafer Inspection Group. "The four systems announced today—flagship products in our inspection and review portfolio—incorporate numerous innovations to help solve defectivity issues across a broad range of applications. Our optical inspectors and e-beam review system find and identify critical nanoscale defects, while achieving high productivity for evaluating how these defects vary across a wafer, wafer-to-wafer and lot-to-lot. We believe this portfolio, by producing comprehensive defect information, can help our customers characterize and optimize their advanced processes to accelerate time-to-market." Utilizing a third-generation broadband plasma illumination source, the 2920 Series patterned wafer defect inspection platform delivers twice the light of its predecessor, enabling the use of a new deep ultra violet (DUV) wavelength band and the industry's smallest optical inspection pixel. Along with new advanced algorithms, these optical modes boost sensitivity to subtle protrusions, tiny bridges and other pattern defects on complex IC device architectures, such as FinFETs. In addition, the 2920 Series' novel Accu-ray™ and Flex Aperture technologies can quickly determine the best optical settings for capture of critical defect types, significantly reducing the time required to discover and solve process and design issues.