Vishay Intertechnology To Showcase Latest Industry-Leading Technologies At 2014 CEF Summer Chengdu Show

Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology line-up for the 2014 CEF (China Electronics Fair) Summer Chengdu show, taking place July 10-12 at the Chengdu Century City New International Convention and Exhibition Center. In hall 3, booth A21A, the company will be highlighting its latest industry-leading innovations, including passive components, diodes, power MOSFETs, power ICs, and optoelectronics.

At the 2014 CEF, Vishay Siliconix will be showcasing TrenchFET ® Gen IV MOSFETs with maximum on-resistance down to 0.00135 Ω at a 4.5 V gate drive; 500 V, 600 V, and 650 V E Series devices for increased efficiency; and low-profile, high-power- density AEC-Q101-qualified SQ Series MOSFETs in the PowerPAK ® SO8L package. Highlighted power ICs will include 2.8 V to 5.5 V buck regulators offering over 93 % efficiency in less than 180 mm2; 4.5 V to 15 V microBUCK ® regulators with ultrafast transient response; 3 V to 28 V regulators with integrated TrenchFET power MOSFETs; and high-density 70 A DrMOS power stages in 5 mm by 5 mm dual-sided cooled packages.

For automotive, commercial, and telecom applications, Vishay will be highlighting diodes in a variety of low-profile packages, including 45 V to 120 V TMBS ® Trench MOS Barrier Schottky rectifiers in the SMPA (DO-221BC) and SMPD (TO-263AC) packages, and FRED Pt ® ultrafast recovery rectifiers in the SlimSMA (DO-221AC) and SMF (DO-219AB) packages. In addition, power modules in the EMIPAK-2B package featuring solderless pressfit technology will be on display. Vishay will also be featuring optoelectronics products such as white high-brightness, high-power LED modules; high-brightness 0402 and 0603 ChipLEDs; SMD LEDs in the PLCC2 package; and fully integrated proximity and ambient light sensors.

Passive components from Vishay will consist of a wide variety of the company’s latest capacitors and resistors. Highlighted resistors will include Vishay Dale Power Metal Strip ® battery shunt resistors with molded enclosures; Vishay Draloric AEC-Q200-qualified thick film chip resistors with long side terminations and enhanced thermo cycling; the Vishay Sfernice massive electro-pyrotechnic initiator chip (MEPIC) resistor for airbags and fireworks, and AEC-Q200-qualified surface-mount thick film power resistors for DC-link applications; Vishay Dale Thin Film chip resistors and dividers with ratio tolerances as tight as 0.01 %; and Vishay MCB’s water cooled wirewound resistor.

Featured capacitors will include Vishay Vitramon AEC-Q200-qualified multilayer ceramic chip capacitors (MLCCs) with high operating temperatures to +150 °C; Vishay Sprague high-temperature solid tantalum surface-mount capacitors and AEC-Q200-qualified devices in small case sizes down to 0603; Vishay BCcomponents surface-mount aluminum capacitors with useful life up to 6,000 hours and ceramic disc safety capacitors for automotive applications; Vishay ESTA power electronic capacitors; and Vishay Roederstein polypropylene film capacitors for DC-link applications.

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