Unisem To Expand Testing Capacity With Teradyne UltraFLEX Test System In Sunnyvale, CA For Engineering And Production Services
Unisem, a global provider of semiconductor assembly and test services,
today announced the addition of a third Teradyne UltraFLEX Test System
to its US-based test development center located in Sunnyvale, CA.
Unisem, a global provider of semiconductor assembly and test services, today announced the addition of a third Teradyne UltraFLEX Test System to its US-based test development center located in Sunnyvale, CA. The UltraFLEX is the most advanced tester for complex SOC devices in the mobile communication, processor and networking spaces. It offers the highest performance Digital, RF, SERDES and DC instrumentation available on any ATE to provide the most precise characterization capability and highest production yields of any ATE in its class. Unique architectural capabilities such as automatically backgrounded DSP and complete instrument control from digital patterns also provide the highest throughput. “The addition of a third UltraFLEX machine to our Sunnyvale facility is another example of our strong partnership and collaboration with Teradyne,” said Marita Erickson, General Manager of Unisem Sunnyvale. “We are pleased to be able to continue offering our customers best in class service, through our focus on providing optimal test solutions.” “Teradyne is pleased to expand our relationship with Unisem," said Greg Smith, VP, SOC Marketing, Teradyne. "As OSATs continue to expand their range of services beyond just turnkey manufacturing, we feel it is important to partner with Unisem as they build a supply chain that encompasses the entire process from test development through volume manufacturing for the benefit of our common customers.” About Unisem Unisem is a global provider of outsourced semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF,analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People's Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.