Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated (NASDAQ:TESS), will showcase solutions from its comprehensive product portfolio, including the new TerraWave Wireless LAN Site Survey Kit, at Cisco Live 2014, May 18-22, in San Francisco. Hosted by Cisco Systems, the conference is the industry’s premier education and training event focused on the innovations of tomorrow – with topics that span technical education, IT management, and service provider programs. For more than 12 years TerraWave, one of Ventev Wireless Infrastructure’s three product lines and a Cisco Solution Developer, has been designing market-leading antenna, cabling, and enclosure solutions that simplify the process of deploying, maintaining and securing Cisco Wi-Fi networks in any environment. Products on display at the show will include:
- New! TerraWave Cisco Indoor AP Wireless LAN Site Survey Kit (TESSCO No. 502643) –enables precise site surveys that eliminate deployment issues and allow for seamless network implementation of Cisco indoor access points. Easy to transport, organize, and inventory, the kit equips system engineers with all of the critical products needed to perform professional site surveys in most environments and industries.
- New! TerraWave High-Density Patch Antenna for Cisco and Meraki Access Points (TESSCO No. 515086) – features a narrow beamwidth and advanced technology that reduces the number of users per access point, increasing the capacity for improved coverage in high-density networks.
- Ventev PoE Outdoor Enclosure System for the Cisco 3602e Access Point (TESSCO No. 566513) – allows indoor access points to be deployed in outdoor environments. For refrigerator-type applications, Ventev also offers a Freezer Enclosure System (TESSCO No. 501516).
- TerraWave Co-Locating Mount (TESSCO No. 568600) – simplifies overall deployments of high-density networks by co-locating the antenna with the access point, and features an aesthetically pleasing design that conceals the access point and cabling.