Kulicke & Soffa Appoints Irene Lee As Senior Vice President, Global Operations And Chief Quality Officer

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”) today announced Irene Lee will take on an expanded role as Senior Vice President, Global Operations and Chief Quality Officer, effective April 1, 2014. Ms. Lee will succeed Alan Schindler, Senior Vice President of Global Operations, who will be leaving after a successful 22-year career with K&S.

CEO and President Bruno Guilmart remarked, “Alan has been instrumental in many of the strategic initiatives to position the Company for the future including transitioning manufacturing to Singapore, strengthening our Asia supply chain, enhancing the flexibility of our operational model, and most recently, relocating our Corporate Headquarters. Irene is well suited to take on this expanded role and her strong background and experience will help drive ongoing and continual operational improvement across our global organization.”

Ms. Lee joined K&S in August 2012 as the Company’s Chief Quality Officer. She is currently working to drive the Company’s global strategic quality initiative and deployment plan that covers overall quality management, business excellence, customer experience management and supplier management. Prior to joining K&S, Ms. Lee was at Seagate Technology International, Inc. (NASDAQ: STX) where she held various operational, engineering, and quality-related positions over her 24-year tenure. In her last role at Seagate Technology, she was responsible for overall factory quality and product reliability engineering for Asia and managed a staff of over 1,000 employees. Ms. Lee received an Advanced Diploma in Mechanical Engineering from Singapore Polytechnic, and a Master’s of Business Administration from the University of Leeds.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. ( www.kns.com)

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