At ARM TechCon 2013, Rambus will demonstrate two memory and interface solutions with its Beyond DDR4 initiative and consumer electronics-oriented R+ DDR3, as well as innovations in Binary Pixel technology and differential power analysis (DPA) countermeasures. Demonstrations:R+ DDR3 PHY Featuring LabStation™ Validation Platform This demonstration of a high-performance, low-cost R+ DDR3 PHY solution is tailored for consumer electronics. The solution will demonstrate operation in working silicon at a data rate of 2133 Mbps in a low-cost wire bond package. The LabStation™ validation platform includes a built-in-self-test and characterization features to achieve high reliability, reduce field returns as well as enable fast time-to-market. Beyond DDR4 – R+ Technology for Next-generation Server Memory This demonstration will showcase next-generation technologies that extend server memory solutions beyond the capabilities of DDR4. With data rates of up to 6.4 Gbps in a multi-rank, multi-DIMM system, this high-performance, high-capacity technology simplifies system design and significantly reduces overall system power requirements.