NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth intensive high speed communications networks, today announced that it will be exhibiting its suite of small form factor Photonic Integrated Circuit (PIC) based optical components for 100G Coherent Transport at the European Conference on Optical Communications (ECOC) in London, England, September 23-25. These small form factor products are designed to meet the requirements of high port density 100G coherent systems and to scale to 200G and 400G applications using higher order modulation schemes. NeoPhotonics is a leading supplier of Narrow Linewidth Tunable Lasers (NLW-TL) and Intradyne Coherent Receivers (ICR), which are key components in the 100G Coherent Transport systems currently being deployed in growing numbers around the world. NeoPhotonics now adds new small form factor versions to its current optical components for coherent systems. The first new product is a narrow-linewidth, micro-Integrable Tunable Laser Assembly (micro-ITLA), which is designed to reduce the footprint by more than a factor of three and to reduce power consumption compared to current generation ITLAs. Furthermore, NeoPhotonics’ micro-ITLA is designed to support the high optical output power and the narrow linewidth required for next generation coherent network architectures. The second product is a Small Form Factor Intradyne Coherent Receiver (SFF-ICR), which is less than half of the size of currently shipping ICRs. The SFF-ICR has the option of an integrated VOA on the signal path and a monitor photodiode (MPD) to simplify board level integration. This versatile device is well-suited for both single incoming channel and multiple incoming channel applications. “Photonic Integration has played a major role in enabling the current generation of coherent systems which are now transforming the optical communications landscape, and we are proud of the contribution NeoPhotonics has made to this sea change,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “As exemplified by these new products, we are utilizing our Photonic Integration technology to bring our customers the benefits of reduced size, reduced power consumption and higher levels of integration and performance,” continued Mr. Jenks.
On Wednesday, Sept. 25 at 11:40 am, Dr. Winston Way, Chief System Architect of NeoPhotonics, will present a talk entitled “Photonic Integrated Circuits for 400 Gigabit and 1 Terabit Coherent Transport” in the “Optical Integration” Session of the Market Focus forum as part of the ECOC Exhibition.NeoPhotonics will exhibit its suite of standard and small form factor PIC-based components for 100G coherent line-side applications, along with its 100G client-side CFP and CFP2 transceivers and its next generation transceivers for access networks at Stand 606 at the European Conference on Optical Communications (ECOC), ICC London ExCeL, London, England, September 23-25. About NeoPhotonics NeoPhotonics is a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth-intensive, high-speed communications networks. The company’s products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley (USA), Japan and China. For additional information, visit www.neophotonics.com. © 2013 NeoPhotonics Corporation. All rights reserved. NeoPhotonics and the red dot logo are trademarks of NeoPhotonics Corporation. All other marks are the property of their respective owners. Forward Looking Statements This press release contains forward-looking statements. Readers are cautioned that these forward-looking statements are only predictions and may differ materially from actual future events or results. These forward-looking statements involve risks and uncertainties, as well as assumptions and current expectations. The company’s actual results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of these risks, uncertainties and assumptions. The risks and uncertainties that could cause the company’s results to differ materially from those expressed or implied by such forward-looking statements include but are not limited to: the timing of or costs related to the small form factor products may not be as the company expects; the demand for the company’s small form factor products may be volatile or lower than the company expects; demand for the company’s small form factor products could decrease from the company’s expectations due to general conditions in the telecommunications equipment industry, changes in network architectures, local economies, or the world economy generally, and other risks and uncertainties described more fully in the company’s documents filed with or furnished to the Securities and Exchange Commission.