Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFD TM) products, Bond Via Array (BVA TM) mobile solutions, and 3DIC technologies at the Intel Developer Forum (IDF), Moscone Center West, San Francisco, Sept. 10-12, 2013. To be exhibited:
- xFD: the company’s latest design wins and product implementations, including tablet and Ultrabook TM solutions from ASUSTeK Computer Inc. featuring SK hynix DRAM memory, Dell Inc. notebooks fabricated by Compal Electronics, Inc., and Intel Xeon-based servers featuring advanced Registered Dual Inline Memory Modules (R-DIMMs). xFD technology connects memory chips in an upside-down shingle-stack configuration, and then interconnects them with ultra-short wire-bonds. The solution significantly reduces component size, increases product bandwidth, speed and power performance, and reduces total system cost by up to 50%.
- BVA: an ultra-high bandwidth Package-on-Package (PoP) solution, brought to high volume market readiness in collaboration with Universal Instruments Corporation (UIC), Kulicke & Soffa Industries, Inc. (K&S), and Celestica Inc., all leaders in their respective industries. BVA technology connects Mobile System on Chip (SOC) processors with their associated mobile memory chips, and delivers significantly greater bandwidth (up to 5 times that of competing solutions), and reduces battery drain, while using existing manufacturing infrastructure.
- 3DIC: novel silicon interposer and 3DIC product demonstrators with Through Silicon Via (TSV) interconnection. Invensas develops pioneering 2.5D and 3D solutions, including fine pitch interposers, advanced TSV plating solutions, and cost optimized process technologies for next generation memory, mobile logic, and sensor products.
About Invensas CorporationInvensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), is a global leader in semiconductor interconnect solutions and intellectual property. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California, Invensas licenses these solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and delivers the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact Invensas PR at +1 408 324 5105 . Invensas, the Invensas logo, xFD and BVA are trademarks or registered trademarks of affiliated companies of Tessera Technologies, Inc. in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies. TSRA-G