- Improved heat management: The trend toward ever-smaller devices with more densely packed electronic components is coinciding with the expanding use of flip chip and stacked die architectures. As a result, the industry is seeking improved thermal management from advanced silicone technologies that effectively dissipate heat and deliver greater device reliability and longer life.
- Enhanced stress passivation: The rapid growth of wafer-level packaging and power electronics is posing new manufacturing challenges for stress mitigation. At issue is thermo-mechanical stress failure caused, in part, by conventional organic passivation materials. This has prompted new explorations in photopatternable silicone solutions that help minimize thermo-mechanical stress during processing, and deliver higher thermal stability and low temperature cure.
- Lower systems costs: Minimizing total cost of ownership is essential for all semiconductor manufacturing applications. But it is a key enabler for next-generation technologies, such as 3D IC integration built on ultra-thin active wafers. These wafers are temporarily bonded to a carrier wafer before being thinned; yet most temporary bonding solutions require costly pre-treatment and specialized chambers. Recent industry collaborations, however, have successfully fielded a simpler, more cost-effective temporary bonding solution based on silicone adhesive and release layers. The breakthrough technology now enables room-temperature bonding and debonding of active and carrier wafers using conventional manufacturing methods.
About Dow CorningDow Corning ( dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning ® and XIAMETER ® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes. ® Dow Corning is a registered trademark of Dow Corning Corporation. ® XIAMETER is a registered trademark of Dow Corning Corporation. ® Responsible Care is a registered service mark of the American Chemistry Council, Inc.