Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated (NASDAQ: TESS), today announced new TerraWave Solutions products to deploy, protect, power, and improve the performance of Cisco networks. Showcased at Cisco Live 2013, these include a horizontal wall-mount access point (AP) enclosure for high-ceiling structures; a mirrored-bubble enclosure for hospital environments; a ceiling tile enclosure to secure the MobileAccess VE Pod as it works with Cisco APs to offload cellular traffic onto Wi-Fi networks; a directional antenna to support the upcoming 802.11ac standard; a dual-band antenna that extends coverage in high-density environments; and two antenna mounts that enhance Cisco antenna coverage. “We are excited to showcase the latest TerraWave-branded innovations at Cisco Live 2013,” said Jeff Lime, vice president of Ventev Wireless Infrastructure. “As a Cisco Developer Network (CDN) Partner, we constantly look for ways to improve our products to better serve Cisco and its customers. Our TerraWave products complement Cisco AP deployments and enhance Cisco wireless infrastructure.” The new horizontal wall-mount enclosure, designed for Cisco’s 1142, 3502i, 3602i, 1602i, and 2602i APs, mitigates issues caused by high-ceiling structures. The enclosure horizontally mounts to dry wall, metal poles or sheet rock, providing ground-level coverage in buildings where vertical ceiling mounting is impossible. The enclosure includes a clear bubble that allows visibility to the AP or a white cover that offers a consistent and aesthetically pleasing design. In addition, TerraWave has designed a special mirrored-bubble enclosure for hospital applications. Its non-metallic, reflective coating, when deployed, can be used to view the immediate surroundings without hindering Wi-Fi coverage. TerraWave has partnered with Corning MobileAccess to design a ceiling-tile enclosure compatible with the MobileAccess VE Access Pod (VAP) and works in conjunction with Cisco APs to offload cellular traffic onto existing Wi-Fi networks. The lightweight enclosure seamlessly integrates into the ceiling tile grid and offers security for the MobileAccess VAP and Cisco AP as they work together to balance network traffic.
“TerraWave’s enclosures offer maximum protection and safety for Cisco APs,” said Lime.With the ratification of 802.11ac quickly approaching, companies and institutions are eagerly awaiting the enhanced capability this new standard will offer. TerraWave has engineered its first 802.11ac-compatible antenna – the 5-GHz, 6-dBi Patch Antenna that has been designed with eight leads and is compatible with most Cisco APs. Another new product is TerraWave’s smallest antenna – the 2.4/5-GHz 2-dBi Bantam Antenna that is 1-1/2 inches tall and compatible with all Cisco APs. This antenna has been deployed in professional stadiums and arenas nationwide, offering extended coverage and enhanced capacity in challenging, high-density environments. To allow companies and institutions to more accurately position their Cisco antennas, TerraWave created two new antenna mounts. The newest mount for Cisco’s Grayling Antenna allows for more precise increments of articulation, optimizing the position of the antenna and the coverage it provides. The mount for Cisco’s AIR-ANT2566P4W-R Patch Antenna provides articulation for an antenna that traditionally can be deployed in a single position. These mounts enhance the coverage that these Cisco antennas provide. To learn more about TerraWave’s product portfolio, visit TerraWave at Cisco Live 2013 (TESSCO Technologies Booth #623), or visit www.terrawave.com. About TESSCO TESSCO Technologies Inc. (NASDAQ: TESS), Hunt Valley, Maryland, is Your Total Source ® for making wireless work. The convergence of wireless and the Internet is revolutionizing the way we live, work and play. New systems and applications are creating opportunities and challenges at an unprecedented rate. TESSCO is there, thinking in new ways for exceptional outcomes. TESSCO ( www.tessco.com) architects and delivers, with innovation, productivity and speed, the product and value chain solutions to organizations responsible for building, using and maintaining wireless broadband systems. About Ventev Wireless Infrastructure Ventev Wireless Infrastructure ( www.ventev.com), a division of TESSCO Technologies Inc., designs and manufactures solutions that deploy, protect, power and improve the performance of every type of wireless network: Wi-Fi, DAS (distributed antenna systems), cellular, mesh and two-way. The company’s high-performance products such as cables, enclosures, antennas, and solar-powered base stations support these networks and their applications both indoors and outdoors. Ventev Wireless Infrastructure’s three branded product lines are: TerraWave Solutions (Wi-Fi enclosures, antennas and cable assemblies); Ventev (integrated power and outdoor enclosure solutions); and Wireless Solutions (base site infrastructure including towers, site hardware and grounding).