Since the introduction of Intel Xeon Phi six months ago, Intel Xeon processors and Intel Xeon Phi co-processors have become a powerful combination now powering many of the world’s fastest supercomputers. Intel Xeon Phi coprocessors based on the Intel® Many Integrated Core (Intel MIC) architecture address the need for higher performing yet more energy efficient and user-friendly technology.“Milky Way 2” - the World’s Fastest Supercomputer Built for the National Supercomputing Center in Guangzhou China, the “Milky Way 2” system is powered by 32,000 of the upcoming 12-core Intel Xeon processors E5-2600 v2 based on Ivy Bridge architecture, and 48,000 Intel Xeon Phi coprocessors, with a total system power of 17.8 MW. Not only is it the fastest, but also one of the most power-efficient systems on the Top500 list. The system uses “neo-heterogeneous architecture,” whereby the hardware architecture has multiple classes of compute capabilities that are accessed by a common programming model, streamlining development and optimization processes – an advantage not possible when using a combination of CPUs and GPU accelerators. The system’s leading performance and energy efficiency were achieved by using the upcoming Intel Xeon processor E5-2600 v2 product family based on Intel’s leading 22nm manufacturing process. In addition to powering the “Milky Way 2”, these processors also power two other systems on the Top500 list from Bull*, the 54 th ranked system with 557 TFlops and the 329 th with 139 TFlops, as part of an “early ship” program Intel uses to equip supercomputer customers. The products will be generally available next quarter, and will feature up to 12 cores and up to 2.7GHz clock speeds, delivering 259 GFlops per socket, a 56 percent increase over the previous generation. More than 80 percent (403 systems) of the supercomputers on the 41 st edition of the Top500 list are powered by Intel processors. Of those systems making their first appearance on the list, Intel-powered installations account for 98 percent. The June edition of the list had recorded 11 systems based on the Intel Xeon Phi coprocessor, including the Petaflops class systems like “Milky Way 2” at 54.9 PFlops and “Stampede” at 8.5 PFlops of peak performance. The semi-annual TOP500 list of supercomputers is the work of Hans Meuer of the University of Mannheim, Erich Strohmaier and Horst Simon of the U.S. Department of Energy’s National Energy Research Scientific Computing Center, and Jack Dongarra of the University of Tennessee. The complete report is available at http://www.top500.org/ New Intel® Xeon Phi™ Coprocessor 3000 and 7000 Product Families Intel also announced the expansion of its current generation Intel Xeon Phi coprocessors with the addition of five new products that feature various performance options, memory capacity, power efficiency and form factors that are available today. The Intel Xeon Phi coprocessor 7100 family is designed and optimized to provide the best performance and offer the highest level of features, including 61 cores clocked at 1.23GHz, 16 GB of memory capacity support (double the amount previously available in accelerators or coprocessors) and over 1.2 TFlops of double precision performance. The Intel Xeon Phi coprocessor 3100 family is designed for high performance per dollar value. The family features 57 cores clocked at 1.1 GHz and 1TFlops of double precision performance.
Lastly, Intel added another product to the Intel Xeon Phi coprocessor 5100 family announced last year. Named the Intel Xeon Phi coprocessor 5120D, it is optimized for high-density environments with the ability to allow sockets to attach directly to a mini-board for use in blade form factors.“Knights Landing” – A Choice of Coprocessor or CPU Intel revealed details of its second generation Intel Xeon Phi products aimed to further increase their supercomputing capabilities. Codenamed “Knights Landing,” the next generation of Intel MIC Architecture-based products will be available as a coprocessor or a host processor (CPU) and manufactured using Intel’s 14nm process technology featuring second generation 3-D tri-gate transistors. As a PCIe card-based coprocessor, “Knights Landing” will handle offload workloads from the system’s Intel Xeon processors and provide an upgrade path for users of current generation of coprocessors, much like it does today. However, as a host processor directly installed in the motherboard socket, it will function as a CPU and enable the next leap in compute density and performance per watt, handling all the duties of the primary processor and the specialized coprocessor at the same time. When used as a CPU, “Knights Landing” will also remove programming complexities of data transfer over PCIe, common in accelerators today. To further boost the performance for HPC workloads, Intel will significantly increase the memory bandwidth for all “Knights Landing” products by introducing integrated on-package memory. This will allow customers to take full advantage of available compute capacity without encountering memory bandwidth bottlenecks experienced today. More information on Intel news from ISC’13 including Raj Hazra’s presentation are available on the Intel Newsroom. About Intel Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com. Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.* Other names and brands may be claimed as the property of others.
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Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_numberIntel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel, Intel Xeon, Intel Xeon Phi, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. Copyright © 2013, Intel Corporation. All rights reserved.