TowerJazz Announces Its Second Half 2013 Global Conference Roadmap; Plenary And Breakout Sessions To Meet Geographic Customer Needs

TowerJazz, the global specialty foundry leader, today announced its global conference roadmap for the second half of 2013. The locations and dates of its Technical Global Symposium (TGS) “Around the Globe” is expanding to meet the geographic needs of its customers. TGS in Japan will take place on July 24, China is planned for September (TBD), Israel for October (TBD) and TGS in the US will take place on November 12-13, 2013. At each location, the event will include a keynote from TowerJazz CEO Russell Ellwanger, presentations by additional company executives, and case studies from TowerJazz customers. In addition, TowerJazz’s latest process technology advancements will be featured including: a next-generation RF SOI platform for handset RF switches and antenna tuners, power amplifier (PA) SiGe technology with advanced features such as thick-Cu interconnects, high-resistivity substrates and TSV, RF MEMS, 0.18um BCD with very-low Rdson devices for power management ICs, and 700V technology for LED lighting and AC/DC conversion, among others.

The theme for TGS 2013 is “From Innovation to Manufacturing for a Smart World.” Presentations will highlight new technologies, their inceptions, their potential, and how TowerJazz has enabled efficient multi-sourcing and quick ramp to volume production. In addition, TowerJazz executives will discuss how the company’s process offerings and design enablement address the three megatrends in the semiconductor industry: 1) Smart Everything, 2) Wireless Everywhere, and 3) Green Everything, along with the implications to fabless companies, integrated device manufacturers and foundries.

As TowerJazz’s worldwide presence continues to grow, TGS “Around the Globe” will further strengthen the foundry’s visibility among customers in multiple regions, build awareness for its broad range of offerings and provide highlights from each business unit: SiGe/RF/HPA, power management, CMOS image sensors (CIS), mixed-signal CMOS, MEMS, Transfer Optimization and development Process Services (TOPS), and Aerospace & Defense. TowerJazz will also present its latest set of sophisticated design kits and models as well as its comprehensive analog IP portfolio. In addition, TowerJazz’s foundry partners -- the leading EDA vendors and tool providers -- will be present to exhibit and demo their solutions to address the design needs of mutual customers.

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