Aehr Test Systems Announces First Production Orders For Next-Generation FOX(TM) Semiconductor Test Systems

FREMONT, Calif., May 30, 2013 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received an order totaling nearly $2 million, with a 30% down payment, for multiple production systems of its next-generation FOX Semiconductor Test System from a leading manufacturer of flash memory devices. The systems are expected to ship in the first half of calendar 2014.

"This order for FOX-1Ps is the first order of what we believe will lead to multiple follow-on systems as our customer ramps capacity in several of their facilities worldwide," said Gayn Erickson president and chief executive officer at Aehr Test Systems. "They are a great lead customer for this new product, and we have already garnered additional interest from several other customers looking at our new FOX-1P for production functional test, wafer level burn-in and process monitor applications.

"There is a lot of interest in our highly-parallel FOX test solutions from IC manufacturers around the world, especially those who are implementing built-in self-test (BIST) and design-for-testability (DFT) features into their products," continued Erickson. "We believe that our FOX family of single and multiple wafer test systems represents a significant breakthrough in meeting the continuous cost of test reductions needed as customers achieve full wafer test. With our unique architecture which allows thousands of individual device power supplies (DPS), 10x or more than other ATE systems, as well as all input/output (I/O), with per pin resources, we are able to address the specific test challenges required by low pin count DFT and BIST modes of the latest logic and memory devices such as microcontrollers, smart cards and flash memory devices."

The next generation FOX-1P extends the capabilities of the Aehr Test FOX-1 by adding high density, low cost I/O and DPS modules with the capability to provide over 16,000 I/O or DPS channels in a single test head for massive parallelism on a single wafer. It has resources to test over 10,000 die on a single wafer with individual DPS channels. Each channel has current monitoring and provides protection of the device and the probe cards that connect the test system to the devices under test.

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