SAN JOSE, Calif., May 8, 2013 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a tier-one provider and innovator of optical communications and laser solutions today unveiled a Distributed Feedback (DFB) 1060 nm laser diode module as the latest addition to its seed laser portfolio, designed for the seeding of sub-nanosecond fiber and solid state lasers. Oclaro will showcase the new DFB seed laser modules, high power lasers, visible and near lasers, and VCSEL technology at the LASER World of PHOTONICS conference, May 13-16, 2013, at the Messe Munchen Trade Fair Center in Munich, Germany. Visit Oclaro at Hall C1, Booth 370. (Logo: http://photos.prnewswire.com/prnh/20130129/SF49903LOGO) The innovative 10xx nm DFB laser diode module, featuring a single-mode laser diode with an on-chip distributed feedback grating delivers high peak power for sub-nanosecond and picosecond pulse operation. Capable of peak powers up to 800 mW for a pulse width as short as150 ps, and a spectral line-width well below 100 pm, the 10xx seed laser enables highly efficient pulse amplification and improved frequency conversions to green and UV wavelengths. It allows customers to easily extend their current nanosecond lasers to the picosecond regime. Operating with these short pulses improves the quality of material processing and mitigates the common SBS (Stimulated Brillouin Scattering) problem with pulse fiber lasers that occurs above 10 ns. In CW mode, the seed laser module delivers 200 mW of optical power with a 3dB line-width of 150 kHz and 50 dB side mode suppression ratio. "The market for picosecond material processing is growing fast as these systems enable higher precision in micromachining by reducing the affected heat zone," said Gunnar Stolze, VP of Sales and Marketing for the Global Industrial and Consumer business at Oclaro, Inc.. "We are partnering with our customers to leverage the exceptional performance of this DFB seed laser to drive innovation in shorter pulse generation for these applications." The DFB seed module features a standard telecom butterfly type package that includes a thermistor and back-facet monitor photodiode. Reliability of the DFB chip has been demonstrated with over 8,000 hours of multi-cell life-testing at accelerated operating conditions with zero failures.