Orbotech Wins $18M In Frame Agreements From Two Leading PCB Makers
Orbotech Ltd. (NASDAQ/GSM: ORBK) today announced that it has signed
major frame agreements, totaling approximately $18 million in value,
with two leading printed circuit board (“
PCB”) makers in Taiwan
Orbotech Ltd. (NASDAQ/GSM: ORBK) today announced that it has signed major frame agreements, totaling approximately $18 million in value, with two leading printed circuit board (“ PCB”) makers in Taiwan and China for the mass production of high density interconnect PCBs. These orders, which are expected to include multiple Paragon™ laser direct imaging (“ LDI”) and automated optical inspection systems, as well as related digital production tools, reflect an increasing level of capital investment by PCB customers in the most up-to-date Orbotech technology used in the manufacture of advanced PCBs for highly sophisticated electronic devices. “We are gratified that these customers, which are major suppliers to several of the world’s top electronics companies, have once again selected Orbotech solutions as part of their strategic growth plan,” commented Mr. Richard Klapholz, Corporate Executive Vice President of Electronics Business at Orbotech Ltd. Mr. Klapholz added: “PCB manufacturers are coming to realize that the significant challenges involved in the mass production of high quality, ultra-thin and increasingly complex boards can now only be met by the use of systems having LDI capabilities. The highly competitive nature of the advanced micro manufacturing segment requires continuous development of new production techniques that can keep pace with the rapid advances in electronics innovation and we are very pleased to be partnering with our customers in this process.” About Orbotech Ltd. Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech’s highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company’s end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company’s filings with the U.S. Securities and Exchange Commission at www.sec.gov. and visit the Company’s corporate website at www.orbotech.com. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only. Cautionary Statement Regarding Forward-Looking Statements Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to its operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected including, without limitation, the timing, terms and success of any strategic transaction, the outcome and impact of the pending criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance, fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2012. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.