Teradyne Presents Innovative Solutions For The Low Cost China Market At SEMICON China 2013

Teradyne, Inc. (NYSE: TER) will present, to a growing Chinese market, focused low-cost ATE solutions in booth #3121 at SEMICON China held in Shanghai on March 19-21. Teradyne will display and perform product demonstrations on the ETS-88, the J750Ex and the Magnum test cell.

" Teradyne has been supporting the Greater China semiconductor industry since 1978 and currently has over 2,800 systems installed in the region," said Houken Tseng, Teradyne Greater China Field Operations manager. "Teradyne has one of the strongest product portfolios in the semiconductor test industry, spanning the entire range of SOC test needs from logic, RF, analog, power, mixed signal and memory technologies, and reliably delivers performance and throughput with low cost-of-test for the broad range of semiconductor devices."

The ETS-88™ is an innovative high performance multisite production test solution designed to test a wide variety of high volume commodity and precision devices including LDOs, PWMs, Battery Chargers, Hot Swap Controllers, Gate Drivers, Power Switches, Op-Amps, and Audio Amps (including Class D).

The J750Ex provides highly economical, parallel test solutions for high-performance microcontrollers, consumer SoC devices and digital wafer sort applications. Teradyne's J750 test system, first introduced in 1998, is one of the most successful platforms in ATE history. With an installed base of over 4,000 systems including over 1,000 systems installed at OSATs, the J750 platform is the most widely available ATE for low cost SoC testing.

Magnum is a highly efficient, production test solution that increases throughput and significantly reduces test time making it ideal for low cost wafer test. The Magnum test cell solution includes the Magnum test system, a Semics OPUS-3 Prober and a Reid Ashman Manipulator. It delivers maximum parallel test and operational efficiency for typical digital, DC and analog tests performed on cost-sensitive SoC applications such as touchscreen controllers. In addition, the Magnum product line is a leader in providing low cost-of-test for production and engineering memory requirements.

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