FREMONT, Calif. and NEWARK, Calif., March 14, 2013 (GLOBE NEWSWIRE) -- Oplink Communications, Inc. (Nasdaq:OPLK), a leading provider of design, integration and optical manufacturing solutions (OMS) for optical networking components, modules and subsystems, and Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced a joint demonstration of the 100Gbps 10x10 40km CFP transceiver technologies for extended reach (ER) 100Gbps applications at OFC/NFOEC 2013 in Anaheim, CA. The 10x10 40km CFP modules, jointly developed by the two companies, enable cost effective deployments of 100G for inter-data center and broadband backhaul applications. The CFP (C form-factor pluggable) transceiver incorporates electro-absorption modulator laser (EML) chips with a wavelength multiplexer in a transmitter optical subassembly and APD (Avalanche Photodiode) receivers with a wavelength demultiplexer in a receiver optical subassembly to support aggregate 100Gb/s data rate, in a standard CFP form factor and electrical interface. The wavelength channels are compatible with 10x10Gbps 2 and 10km reach as defined by the 10x10 MSA. Samples will be available in the second quarter of calendar year 2013, with production release planned for third quarter of calendar year 2013. "With increasing bandwidth demand from broadband mobile and cloud computing applications, service providers and data center operators require economical 100Gbps bandwidth upgrade solutions. Our 10x10 40km CFP is designed for integration with volume-deployed, mature and, low cost 10Gbps components, and is ideally suited for 100Gbps extended reach inter-data center connections and wireless and wireline service backhauling applications, at a most compelling cost point," commented Dr. Rang-Chen Yu, Vice President of Business Development of Oplink. "The 10x10 40km CFP nicely complements our other client and line side 100G module solutions, such as 100G LR4 CFP2 and 4x28G DWDM CFP." "The 10x10 40km CFP leverages Kaiam's MEMS-based hybrid integration technology that supports the fabrication of dense multi-channel modules using generally available tested components. The critical optical alignment and attachment between components is achieved through silicon micro-mechanics, Kaiam's patented integration engine technology. The packaging platform enables integration of complex high-performance functions at low cost and a small footprint, making it ideal for 100Gbps applications," commented Byron Trop, Vice President of Sales and Marketing for Kaiam Corporation.