BARCELONA, Spain, Feb. 25, 2013 /PRNewswire/ -- Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the expansion of its long-standing relationship with Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), marked by the introduction of a 4G LTE product and the development of variants for the company's top selling 3G modules in the xE910 product family. The complete portfolio allows Telit to offer form-factor compatible Qualcomm Technologies-based solutions for CDMA, UMTS and LTE radio technologies to address the communications needs of M2M and Internet of Everything (IoE) application developers. The LE910, based on Qualcomm Technologies' Gobi TM MDM9215, will be Telit's first LTE module delivered in the xE910 product family, and the company's second LTE offering, following the LE920 LTE automotive-grade module announced last year, also based on the MDM9215. In January 2013, Telit introduced two new xE910 modules—the HSDPA UE910 V2 based on Qualcomm Technologies' QSC6270-Turbo chipset and HSPA+ HE910 V2 based on Qualcomm Technologies' MDM6200 chipset—to address the growing demand for 3G solutions. Variants of both products with support for Oracle Java ME Embedded 3.2 are being planned. With the LE910, the xE910 product family is now poised to address not only the 2G to 3G migration, but also the growing set of opportunities and applications that require LTE. The Qualcomm Technologies' chipsets have enabled Telit to build the xE910 family to provide interchangeability between 3GPP2—CDMA (1xRTT, EV-DO) and 3GPP—UMTS (HSDPA, HSPA+) and LTE variants, making the adaptation of customer applications to regional technical requirements quick and easy while minimizing time to market and total cost of ownership. In the Telit booth at Mobile World Congress (Hall 5, G70) visitors can glean the breadth of the product portfolio at the "Qualcomm Technologies Corner," including existing and prototype products and their respective chipsets. Included in the display will be the LE910 product concept and a number of commercially available and prototype modules for the automotive industry.