IXYS Corporation (NASDAQ: IXYS), a leader in power semiconductors and HVIC technologies for energy efficient products used in power conversion and motor control applications, announced today a new bipolar module platform for high power applications. The new ComPack family represents a compact package with the highest power density. The ComPack design is resulting from the implementation of the newest assembly methods in combination with the proprietary ‘power metallization chip’ technologies of IXYS. Advancement in the module design as well as the silicon die technology leads to a user-friendly product that fulfills the highest needs in reliability and functionality. First products are dual die or phase-leg topology using both anode side and cathode side soldering options to make available dual thyristor, dual diode or thyristor/diode combinations. The modules have a rated current of 600 Amperes per leg, improved surge rating and a maximum junction temperature of 140 Deg C. “The ComPack module is an excellent example of how innovations in design can provide benefits to our customers. Previous designs of a phase leg bi-polar module and similar competitive offerings are only rated between 500 amperes and 570 amperes. However, the ComPack is rated at 600 Amperes and up to 2,200 volts per die but has a 33% reduced footprint and weighs 76% less than current alternatives, significantly illustrating how IXYS’ MORE POWER, LESS PACKAGE design philosophy can reduce transportation costs across the whole of the value chain,” commented Bradley Green, the President of European Sales and Business Development. “Modules of this size and power had previously had issues in high transportation cost and its associated carbon footprint both at the manufacturer and further when installed in our customers’ equipment. By providing a much smaller module at far less weight but at improved reliability, power range and ruggedness, IXYS provides the perfect solution to our cost and environment sensitive customers,” added Mr. Green.