IXYS Corporation (NASDAQ: IXYS), a leader in power semiconductors and HVIC technologies for energy efficient products used in power conversion and motor control applications, announced today a new bipolar module platform for high power applications. The new ComPack family represents a compact package with the highest power density. The ComPack design is resulting from the implementation of the newest assembly methods in combination with the proprietary ‘power metallization chip’ technologies of IXYS. Advancement in the module design as well as the silicon die technology leads to a user-friendly product that fulfills the highest needs in reliability and functionality. First products are dual die or phase-leg topology using both anode side and cathode side soldering options to make available dual thyristor, dual diode or thyristor/diode combinations. The modules have a rated current of 600 Amperes per leg, improved surge rating and a maximum junction temperature of 140 Deg C. “The ComPack module is an excellent example of how innovations in design can provide benefits to our customers. Previous designs of a phase leg bi-polar module and similar competitive offerings are only rated between 500 amperes and 570 amperes. However, the ComPack is rated at 600 Amperes and up to 2,200 volts per die but has a 33% reduced footprint and weighs 76% less than current alternatives, significantly illustrating how IXYS’ MORE POWER, LESS PACKAGE design philosophy can reduce transportation costs across the whole of the value chain,” commented Bradley Green, the President of European Sales and Business Development. “Modules of this size and power had previously had issues in high transportation cost and its associated carbon footprint both at the manufacturer and further when installed in our customers’ equipment. By providing a much smaller module at far less weight but at improved reliability, power range and ruggedness, IXYS provides the perfect solution to our cost and environment sensitive customers,” added Mr. Green.
Internally IXYS’ Direct Copper Bonded (DCB) ceramic technology provides a high isolation voltage of 4800 V which is in line with Underwriters Laboratory (UL) requirements. With the adapted copper base plate, the ComPack concept achieves very low thermal impedance and helps reduce the module weight yet, supports long-term reliability under highest power output operation.With this development, IXYS is allowing the designer to switch more power than historically available, thereby facilitating higher power densities, greater material efficiency and lower systems cost and lower weight in motor control, soft starter, UPS or input rectification applications. For more information on the ComPack Module please refer to www.IXYS.com or contact your nearest IXYS sales office. About IXYS Corporation Since its founding, IXYS Corporation has been developing power semiconductors and mixed signal ICs to improve power conversion efficiency, generate solar and wind power and provide efficient motor control for industrial applications. IXYS and its subsidiary companies offer a diversified product base that addresses worldwide needs for power control in the growing cleantech industries, renewable energy markets, telecommunications, medical devices, transportation applications, flexible displays and RF power. Safe Harbor Statement Any statements contained in this press release that are not statements of historical fact, including the benefits, savings, efficiency, performance, features and suitability of products for various applications, may be deemed to be forward-looking statements. There are a number of important factors that could cause the results of IXYS to differ materially from those indicated by these forward-looking statements, including, among others, risks detailed from time to time in the Company's SEC reports, including its Form 10-Q for the quarter ended December 31, 2012. The Company undertakes no obligation to publicly release the results of any revisions to these forward-looking statements.