Rambus To Showcase Key Innovations At DesignCon 2013

Rambus Inc. (NASDAQ: RMBS)


Rambus Inc. (NASDAQ: RMBS)


DesignCon 2013
Santa Clara Convention Center – Booth #301
Santa Clara, CA


January 28 – 31, 2013

At DesignCon 2013, Rambus will unveil the innovative R+ enhanced industry standards platform. R+ offers the commercial benefits of industry-standard memory and chip-to-chip interfaces while enabling customers to differentiate products through specialized solutions. Additionally, Rambus will showcase innovations in 3D IC interposer technology. Rambus will be at booth #301, at the Santa Clara Convention Center in Santa Clara, CA.

Engineers from Rambus will also be presenting six technical papers on topics including: mixed signal designs, 3D interposers, memory controllers and 3D DRAM, high speed coded differential signaling, high-speed parallel buses and more. (see


Rambus Demonstrations:

Extending Main Memory Beyond DDR4 – An R+ Technology

The demonstration showcases technologies that can extend main memory beyond DDR4. With data rates of up to 6.4Gbps in a multi-rank, multi-DIMM system, this high-performance, high-capacity technology simplifies the system design and significantly reduces the overall system power requirements.

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