Rambus To Showcase Key Innovations At DesignCon 2013

Rambus Inc. (NASDAQ: RMBS)
   

Who:

Rambus Inc. (NASDAQ: RMBS)
 

Where:

DesignCon 2013
Santa Clara Convention Center – Booth #301
Santa Clara, CA
 

When:

January 28 – 31, 2013
 

At DesignCon 2013, Rambus will unveil the innovative R+ enhanced industry standards platform. R+ offers the commercial benefits of industry-standard memory and chip-to-chip interfaces while enabling customers to differentiate products through specialized solutions. Additionally, Rambus will showcase innovations in 3D IC interposer technology. Rambus will be at booth #301, at the Santa Clara Convention Center in Santa Clara, CA.

Engineers from Rambus will also be presenting six technical papers on topics including: mixed signal designs, 3D interposers, memory controllers and 3D DRAM, high speed coded differential signaling, high-speed parallel buses and more. (see

RAMBUS TO PRESENT SIX PAPERS AT DESIGNCON 2013).

Rambus Demonstrations:

Extending Main Memory Beyond DDR4 – An R+ Technology

The demonstration showcases technologies that can extend main memory beyond DDR4. With data rates of up to 6.4Gbps in a multi-rank, multi-DIMM system, this high-performance, high-capacity technology simplifies the system design and significantly reduces the overall system power requirements.

If you liked this article you might like

Fight Off Complacency: Cramer's 'Mad Money' Recap (Fri 9/15/17)

Analysts' Actions -- Land's End, IBM, Stericycle, Rambus and More

Analysts' Actions -- Time Warner, Cree, Dynegy, Autoliv and More

Futures, Asia Lower As Trump Uncertainty Weighs Ahead of Earnings

5 Things You Must Know Before the Market Opens Monday