- Dow introduces the first two polishing pad families under its new IKONIC™ chemical mechanical planarization (CMP) pad platform.
- Dow brings to market two new MICROFILL™ copper plating products that enhance the performance of high density interconnect (HDI) and IC substrate PCBs.
- Dow unveils critical performance advances for its EUV photoresists and ancillary lithography materials.
MICROFILL Electrolytic Copper for HDI and IC Substrate PCBsSmartphones and tablets have become the primary driver for the ever-increasing circuit density of today’s PCB designs, and MICROFILL plating products deliver critical technologies to enable miniaturization of next generation devices. Dow has brought to market its MICROFILL THF-100 Electrolytic Copper for through-hole fill of substrate core layers, and is set to launch its MICROFILL LVF Via Fill Electrolytic Copper for enhanced microvia filling in early 2013. MICROFILL products can help meet customers’ needs for high density interconnect products, improved performance and reliability, and reduced cost of ownership. EUV Materials Portfolio As manufacturers work to increase the number of chips on a wafer in order to meet the size and performance requirements of next-generation mobile devices, current approaches to photolithography are becoming complex and expensive, necessitating the development of new patterning technologies. EUV represents an opportunity to further advance electronics and drive Moore’s Law. Dow is actively pursuing the development of its EUV photoresists and ancillary materials to meet these emerging requirements. Dow has recently demonstrated an improvement of the resolution, line-width roughness and sensitivity of its EUV chemically amplified resists. The company expects its EUV portfolio to be market-ready for the adoption of EUV in high volume manufacturing. “EUV lithography is widely viewed as an enabling technology for next-generation devices to come to market,” said Cathie Markham, global director, research & development, Dow Electronic Materials. “Dow has invested strongly in this technology, working in close collaboration with leading chip manufacturers and industry development centers. Based on our strong imaging background and our dominant R&D capabilities, our portfolio of EUV materials is already demonstrating industry-leading performance,” said Markham. About Dow Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company connects chemistry and innovation with the principles of sustainability to help address many of the world's most challenging problems such as the need for clean water, renewable energy generation and conservation, and increasing agricultural productivity. Dow's diversified industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 160 countries and in high growth sectors such as electronics, water, energy, coatings and agriculture. In 2011, Dow had annual sales of $60 billion and employed approximately 52,000 people worldwide. The Company's more than 5,000 products are manufactured at 197 sites in 36 countries across the globe. References to "Dow" or the "Company" mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.