“Lab to Fab” Flexible ConfigurationUsers can select the configuration optimal for their needs, either stand-alone or in-line, enabling the F7000 to support a wide array of applications from R&D to volume production. High Throughput With increased current density, the F7000 achieves a write speed fully 5 times faster than its predecessor model, the F3000. Small Footprint The F7000 features a footprint 40% smaller than that of the F3000.
|Substrates supported for lithography:||Wafers (300mm, 200mm, 3-6in.)|
|Glass substrates (6025)|