Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.
“Lab to Fab” Flexible ConfigurationUsers can select the configuration optimal for their needs, either stand-alone or in-line, enabling the F7000 to support a wide array of applications from R&D to volume production. High Throughput With increased current density, the F7000 achieves a write speed fully 5 times faster than its predecessor model, the F3000. Small Footprint The F7000 features a footprint 40% smaller than that of the F3000.
|Substrates supported for lithography:||Wafers (300mm, 200mm, 3-6in.)|
|Glass substrates (6025)|