FREMONT, Calif., Oct. 10, 2012 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received a significant order from a leading semiconductor manufacturer for development of a next generation FOX-1 system. The system development is expected to complete in calendar year 2013. "We believe it is very significant that this customer is working with us to develop our next generation FOX-1 system," said Carl Buck, vice president of marketing at Aehr Test Systems. "This new FOX system is designed to provide the customer with increased test flexibility and capability at a significantly lower cost of test than alternative solutions while also expanding the markets addressed by our FOX full wafer test products." The FOX-1 full wafer parallel test system has the capability to test thousands of die in a single touchdown, thus providing a cost-effective solution for devices with long test times such as flash and microcontrollers with embedded flash. Other members of Aehr Test's FOX family of products are focused on long-duration full wafer burn-in and test of products such as automotive ICs, MCUs, DRAMs and VCSELs (laser diodes). About Aehr Test Systems Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTS TM and FOX family of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the Company's website at www.aehr.com.
CONTACT: Aehr Test Systems Carl Buck V.P. of Marketing (510) 623-9400 x381 Financial Relations Board Marilynn Meek Analyst/Investor Contact (212) 827-3773