Freescale Unveils Two-Stage LNAs To Support Multiple Air Interfaces For Wireless Base Stations In A Single System
Freescale Semiconductor (NYSE: FSL) today announced new two-stage,
low-noise amplifiers (LNAs) that address two gain stages in one device
and deliver coverage across multiple bands to simplify wireless base
Freescale Semiconductor (NYSE: FSL) today announced new two-stage, low-noise amplifiers (LNAs) that address two gain stages in one device and deliver coverage across multiple bands to simplify wireless base station designs. With an increasing amount of LTE-capable devices and the fragmentation of band configurations in today’s networks, solutions that support a variety of bands and protocols are required to enable devices that address consumer networking demands. Freescale addresses these needs with its new, two-stage LNAs, which eliminate the need for an additional gain stage while keeping an optimal mix of low noise and high gain. Freescale’s MML09212H and MML20242H two-stage LNAs feature noise figures of 0.52 and 0.57 dB and exhibit 37.5 dB gain for low band frequencies and 34 dB gain for high band frequencies, respectively. Providing coverage across multiple bands and protocols, including LTE and WCDMA, the LNAs allow wireless base station OEMs to reach gain capabilities typically achievable with two separate devices and receive coverage across a spectrum of wireless network and band configurations. “Integrating multiple solutions that can be used across a variety of interfaces is a challenging process for wireless base station providers,” said Ritu Favre, vice president and general manager of Freescale’s RF Division. “Our new LNAs offer a single compact solution, eliminating the need for a supplementary amplifier, supporting popular interfaces such as LTE and WCDMA and helping designers reduce development time and more efficiently prepare next-generation networks to support the influx of LTE users.” The new two-stage LNAs offer a high overall third-order output intercept point (OIP3), enabling lower distortion and increased stability through temperature changes. Housed in a tiny 3 mm package, the compact solution helps developers reduce their overall chip count and board space. The devices are designed to support the receiver requirements of wireless base stations, from femto to macro cell capacities, and to support a range of air interfaces, including LTE and WCDMA/CDMA.