SUNNYVALE, Calif., Aug. 30, 2012 (GLOBE NEWSWIRE) -- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors, today introduced the AOC2403 – the industry's first Molded Chip Scale Package (MCSP) in a tiny 0.97mm x 0.97mm x 0.3mm power package. Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. The significant performance improvements of the MCSP technology make it ideal for the latest ultra-portable applications such as smart phones, tablet PCs, UltraBooks and other mobile hand-held devices.
AOC2403 is a 20V 95mOhm P-Channel MOSFET housed in a halogen-fee MCSP. The package dimensions are 0.97mm x 0.97mm x 0.3mm. The AOC2403 is the cornerstone on which additional first-class MCSP products are being developed.Device Specification Table
|Part Number||V DS (V)||V GS (V)||R DS(ON)MAX||Q g (typ)||I D @ T A = 25°C|
|@ 4.5V (mOhms)||@ 2.5V (mOhms)||@ 1.8V (mOhms)||@ 1.5V (mOhms)||(nC)||(A)|
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