Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFD TM) technology at the Intel Developer Forum (IDF), Moscone Center West, San Francisco, Sept. 11-13, 2012. To be exhibited:
- Netlist Inc., a leading provider of high performance memory modules, introduces Dual Face Down (DFDTM) DDR3/DDR4 components into their HypercloudTM platform for servers, workstations and high-performance computing.
- DIMM-IN-A-PACKAGETM, the groundbreaking solution for UltrabooksTM and Tablets, which has now gained initial Original Equipment Manufacturer (OEM) adoption and will replace bulky Dual Inline Memory Modules (DIMMs) with much smaller, cheaper and more power efficient semiconductor packages.
- 3D Through Silicon Via (TSV), and mobile memory solutions, including Bond Via Array (BVA), high-bandwidth package-on-package (PoP) solution for next generation Smartphones and handheld devices, are displayed.
About Invensas CorporationInvensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com. Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies. TSRA-G INV-G