ESI Enters Low Cost Depanelization Market With Its New Model 5950
Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of
innovative laser-based manufacturing solutions for the microtechnology
industry, today announced the adoption by multiple customers of its new
Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced the adoption by multiple customers of its new 5950 low-cost microfabrication system. With proprietary beam steering technology for high throughput processing, the 5950 provides customers a low cost of ownership, setting a new industry standard in printed circuit board singulation. The 5950 is a small footprint system specifically designed to handle standard, fully occupied printed circuit boards. The 59xx family of laser micromachining tools offers customers a broad range of features to control cutting shape, throughput, and laser-material interaction. The 5950 system is targeted at the printed circuit board market that supports consumer electronics, specifically circuit boards supplied to the mobile segment. The 5950’s high precision beam steering technology allows customers to minimize spacing between adjacent devices, thereby maximizing the number of functional parts per board; likewise, the system’s proprietary laser technology eliminates carbonization common to other laser processing tools. ESI has over 300 59XX systems deployed in 24/7 high volume manufacturing lines worldwide. “ESI continues to deliver innovative laser-based solutions as demonstrated by the acceptance of our 5950 depanelization system,” said Dr. Michael Darwin, Vice President and General Manager of ESI’s Interconnect and Microfabrication Division. “We are confident that our precise beam steering technology combined with proprietary processing and low cost tooling will enable customers to deliver cost effective products. Moving away from mechanical routing tools for singulation makes a lot of sense in many applications, especially applications where reducing the street width can increase the number of parts manufactured per board or where the board is just too thin to machine with a mechanical process.” About ESI, Inc. ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring of micron to submicron features in electronic devices, semiconductors, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the microelectronics, semiconductor and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
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