Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA), today unveiled its bond via array (BVA) technology. BVA is an ultra-high I/O packaging alternative to wide-I/O through silicon via (TSV) that delivers the performance required by mobile OEMs while preserving the proven infrastructure and business model of traditional package-on-package (PoP). Invensas’ BVA technology enables high-performance consumer electronics to overcome the processing demands of next-generation designs without altering existing packaging infrastructure. This makes it an ideal low-cost and highly adoptable solution for mobile device manufacturers. BVA PoP is ideally suited for applications processor plus memory PoP stacks. By increasing processor to memory bandwidth, BVA PoP enables higher resolution, faster frame rate video streaming, faster search, higher resolution multi-screen, multi-application operation, more life-like gaming and a whole new generation of high-resolution 3D applications. “The challenge in today’s mobile devices is that they all need to support high resolution screens, real-time downloads, high-definition, 3D and other advanced graphics processing capabilities that require an exponential increase in processor to memory bandwidth,” stated Simon McElrea, president of Invensas. “BVA PoP technology is able to significantly increase bandwidth to enable advanced smartphone and tablet features that are unachievable with today’s conventional technologies. With BVA we are bringing to market another cost effective solution to a critical industry problem by way of improved product performance and value.” The ultra-high I/O offered by BVA far exceeds what is possible with today’s solder ball stacking and solder filled laser via approaches and permits intermediate increases in bandwidth in PoP, delaying the need for TSV. A copper wire bond-based package stacking interconnect technology, BVA PoP enables reduced pitch and a higher number of interconnects in the PoP perimeter stacking arrangement. It has demonstrated scalability to a 0.2mm pitch, leapfrogging the current capabilities of solder ball and solder via stacking to meet the industry’s desired increase in bandwidth. Additionally, BVA PoP’s alternative interconnect system is able to achieve wide I/O capability using common, low cost wire-bond technology. Because BVA PoP utilizes the existing package assembly and surface mount technology (SMT) infrastructure, it does not require a large capital investment and can be quickly adopted to provide increased bandwidth at low cost.
“With this new approach we’re taking PoP from 240 pins to 1,200 pins. In doing so, BVA significantly pushes out the need for 3D-TSV. At the same time, it renders solder via obsolete as it is able to cost-effectively scale to ultra-high I/O,” continued McElrea.Invensas will present its BVA PoP solution at the Electronic Components and Technology Conference (ECTC) at the Sheraton San Diego Hotel and Marina in San Diego. Titled "Fine Pitch Copper PoP for Mobile Applications" the paper will be part of Session 31, “Applications With 3D Technology,” at 4:45 PM on Friday, June 1, 2012. Invensas will also exhibit at ECTC in booth 107 on May 30 and 31, 2012. Safe Harbor Statement This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, benefits and characteristics of Invensas’ BVA technology, the adoption of BVA in the market and its ability to replace existing technology, and Invensas’ participation at ECTC, as well as the subject matter of Invensas’ presentations at such conference. Material factors that may cause results to differ from the statements made include changes to the plans or operations relating to Tessera Technologies, Inc.’s (the “Company”) businesses; market or industry conditions; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or any invalidation or limitation of key patents; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses, including the pending acquisition of Flextronics's camera module business in Zhuhai, China; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; failure of the Company’s subsidiary, DigitalOptics Corporation, to become a vertically integrated camera module supplier; and the reliance on a limited number of suppliers for the components used in the manufacture of DigitalOptics products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this media alert. The Company’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2011, and its Quarterly Report on Form 10-Q for the quarter ended March 31, 2012, include more information about factors that could affect the Company’s financial results. The Company assumes no obligation to update information contained in this press release. Although this press release may remain available on the Company’s and Invensas’ website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
About Invensas CorporationInvensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com. Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies. TSRA-G INV-G