Teradyne, Inc. (NYSE: TER) will showcase its broad portfolio of test systems, including the ETS-88™, Magnum and UltraFLEX-HD, in booth #2169 at SEMICON China in Shanghai on March 20-22. Teradyne will host demonstrations on each of the systems. "We are pleased to be participating in SEMICON China for the twelfth consecutive year," said Houken Tseng, Teradyne Greater China Field Operations manager. "Teradyne has been supporting the Greater China semiconductor industry since 1978 and has over 2,500 systems currently installed in the region. Our product portfolio is one of the strongest in the semiconductor test industry, spanning the entire range of SOC test needs from logic, RF, analog, power, mixed signal and memory technologies." The ETS-88 is an innovative high performance multisite production test system designed to test a wide variety of high volume commodity and precision devices including LDOs, PWMs, Battery Chargers, Hot Swap Controllers, Gate Drivers, Power Switches, OPAMPs, Audio Amps (including Class D), Video Amps and more. With up to four available independent test heads operated from a single computer, the ETS-88 provides the capability to test multiple devices on separately controlled handlers or probers simultaneously. The UltraFLEX test system is the ideal production solution for complex, leading edge SOC devices. It is used in production to test some of the highest performance mobile processors, RF SOCs and power management devices in leading smart phones and tablets. With industry leading parallel test efficiency and RF instrument accuracy, customers achieve optimum yield and cost of test. Targeted at the high-growth flash, logic, and SOC markets, the Magnum SV is a highly efficient, production-test solution that increases throughput and reduces test time. When combined with the appropriate prober or handler, the system creates an interface solution capable of testing up to 128 devices in parallel for the cost-sensitive consumer digital device market.