Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ: TSRA) will be presenting and exhibiting at the 8th International Conference and Exhibition on Device Packaging, to be held March 6-8, 2012 in Scottsdale/Fountain Hills, Arizona. WHO:Simon McElrea WHAT:3D Packaging Solution Providing DDR & LPDDR Co-Support for Ultrabooks and Next Generation Servers WHERE:8th International Conference and Exhibition on Device PackagingRadisson Fort McDowell Resort and CasinoScottsdale/Fountain Hills, Arizona WHEN:March 8, 201211:00am – 11:30am Safe Harbor Statement This media alert contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas’ participation at the 8th International Conference and Exhibition on Device Packaging, as well as the subject matter of Invensas’ presentations at the conference. Material factors that may cause results to differ from the statements made include changes to the plans or operations relating to Tessera Technologies, Inc.’s (the “Company”) businesses; market or industry conditions; the future expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or any invalidation or limitation of key patents; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to adopt technologies covered by the Company's patents; the future expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses, including the pending acquisition of Flextronics's camera module business in Zhuhai, China; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; failure of the Company’s subsidiary, DigitialOptics Corporation, to become a vertically integrated camera module supplier; and the reliance on a limited number of suppliers for the components used in the manufacture of DigitalOptics products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this media alert. The Company’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2011, include more information about factors that could affect the Company’s financial results. The Company assumes no obligation to update information contained in this media alert. Although this media alert may remain available on the Company’s and Invensas’ website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
About Invensas CorporationInvensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ: TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com. Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.