Applied Micro Circuits Corporation, or AppliedMicro (Nasdaq: AMCC) today announced it is sampling S28010 Gearbox integrated circuit devices for 100 Gigabit Ethernet and OTU4 optical interfaces. The S28010 enables the industry’s most cost-effective, power-efficient 100GBASE-xR4 and OTU4 optical modules with a single-chip CMOS device with superior performance to 28.1 Gbps. AppliedMicro will demonstrate the S28010 Gearbox at OFC/NFOEC 2012 from March 6-8 in Los Angeles. Optical module vendors are designing next generation CFP modules compliant with 100GBASE-LR4, 100GBASE-ER4 and OTU4.4 standards to expand optical connection speeds from 10Gbps to 100Gbps for high-end switching and routing equipment in the data center and in client interfaces to service providers. Until now, industry adoption efforts have been slowed by high-cost, power-hungry SiGe or FPGA integrated circuits that are limited and unable to provide transport-quality performance and reliability. AppliedMicro’s 28010 Gearbox tackles the challenge by enabling SiGe-like performance in a reliable, low-power CMOS process and enables system designs with the flexibility to transport Ethernet, Fibre Channel and Optical Transport Network traffic. “Data center and access network developers have been eager for 100GBASE-R4 Gearbox devices that lower power and cost while improving reliability and availability,” said George Jones, Vice President of AppliedMicro’s Transport Business Unit. “The S28010 is designed to allow module vendors to supply CFP-based solutions that support Ethernet, Fibre-channel and Optical Transport Networks using a single chip, exceeding jitter requirements in the process. The 28Gbps interface contains enhanced equalization for line-card compatibility with CFP2 and potentially CFP4 modules when they become available. The S28010 also integrates ODB precoding and decoding to support metro applications.” AppliedMicro’s Gearbox translates the 10-lane, 10Gbps CAUI electrical interface to 4-lanes operating from 25.7 up to 28.1 Gbps. It is compliant with IEEE802.3ba, the CFP MSA and OIF-28G-SR standards. The fully-integrated single-chip solution reduces module bill of materials and with power consumption below 4 watts, it is less than 50 percent of comparable 2-chip BiCMOS solutions. The result is reduced system heat and lower operational costs without compromising performance.