Viasystems Group, Inc. (NASDAQ:VIAS) expects to participate in the Houlihan Lokey Technology, Media & Telecom Conference at the Grand Hyatt in New York, NY, on October 27, 2011. Mr. David Sindelar, Chief Executive Officer, and Mr. Jerry Sax, Chief Financial Officer, will make a presentation to investors at approximately 11:05 a.m. Eastern Time. The presentation will be webcast at http://investor.viasystems.com/events.cfm. The audio webcast will be archived at the same location for approximately 90 days.

About Viasystems

Viasystems Group, Inc. is a technology leader and a worldwide provider of complex multi-layer, printed circuit boards (PCBs) and electro-mechanical solutions (E-M Solutions). Its PCBs serve as the “electronic backbone” of electronic equipment, and its E-M Solutions products and services integrate PCBs and other components into electronic equipment, including metal enclosures, cabinets, racks and sub-racks, backplanes, cable assemblies and busbars. Viasystems’ 15,000 employees around the world serve more than 800 customers in the automotive, industrial & instrumentation, telecommunications, computer and datacommunications and military and aerospace markets. For additional information about Viasystems, please visit the Company’s website at www.viasystems.com.

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