ARM and UMC (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan® Physical IP solutions validated on UMC’s 28HPM process technology. This latest 28nm process technology targets a wide range of applications that includes portable devices, such as mobile and wireless, and high performance applications, such as digital home and high-speed networking. Harnessing the strengths of both companies, this collaboration will deliver superior technology and support to mutual customers. “We are pleased that UMC has selected ARM Artisan Physical IP for its 28HPM process. Mutual customers will now have access to a complete solution of advanced physical IP that is highly suited for implementing ARM technology , such as the ARM Cortex™-A processor series,” commented Simon Segars, executive vice president and general manager, Physical IP Division, ARM. ”Extending the relationship between ARM and UMC will enable deeper collaboration and innovation in the development of process technology and advanced physical IP at 28nm nodes. This will result in optimized performance, energy efficiency and chip density, and extends ARM’s commitment to deliver rich technology platforms for advanced node designs.” “We are delighted to expand our long-standing relationship with ARM, which spans over 10 years," said S. C. Chien, vice president, Customer Engineering & IP Development Design Support Divisions, UMC. "This UMC-sponsored development will provide customers with access to the most comprehensive ARM physical IP solutions on UMC’s versatile and robust process technologies. This will enable faster time-to-market for critical market segments. The cooperation further demonstrates our commitment to delivering industry leading resources for customers designing into UMC’s most advanced 28nm process node.” Featuring the superior performance, ultra-low leakage of high-K metal gate device structure, UMC’s gate-last 28HPM process technology offers many options for device voltages, memory bit-cells, underdrive and overdrive capabilities to help SoC designers realize both high performance and extended battery life. UMC’s 28HPM process technology is scheduled for pilot production in mid 2012.
About UMCUMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com About ARM ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM’s comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company’s broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM by following these links:
- ARM website: http://www.arm.com/
- ARM Connected Community: http://www.arm.com/community/
- ARM Blogs: http://blogs.arm.com/
- ARMFlix on YouTube: http://www.youtube.com/user/ARMflix
- ARM on Twitter:
Note From UMC Concerning Forward-Looking StatementsSome of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.