SAN JOSE, Calif., Sept. 14, 2010 (GLOBE NEWSWIRE) -- OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) high-speed DDR3 desktop memory, providing the optimal balance of performance and power efficiency in one solution. Committed to staying ahead of the curve, OCZ is offering enthusiast-grade memory that complies with the latest JEDEC "DDR3L" low-voltage standards which ensures that system RAM runs cooler and more efficiently during intensive multi-tasking, gaming, and productivity applications. "We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings." Developed for next generation platforms, OCZ Platinum ELV solutions run at only 1.35 volts and are the choice counterparts for leading-edge performance and reliability, meeting the demand for high-speed memory to function farther below the upper voltage threshold of Intel® Core™ i3, i5, and i7 processors. With an ideal combination of speed and latency, OCZ Platinum ELV 6GB and 4GB memory kits are specifically designed and qualified on a range of motherboards supporting this low voltage feature. In addition to ELV solutions, OCZ's new Reaper HPC (Heat Pipe Conduit) and Gold ULV memory operate at 1.5 volts for power savings over the maximum recommendation of 1.65V for the latest enthusiast and mainstream Intel platforms. Furthermore, Reaper and Gold ULV kits are available in high-density 12GB and 8GB configurations, supporting the latest memory-hungry applications and games with superior performance and maximum productivity, all while helping to maintain a cooler case environment. OCZ DDR3 ELV and ULV triple-channel and dual-channel memory kits are available in PC3-12800 (1600MHz) and PC3-10666 (1333MHz) speed ratings, are 100% hand-tested for quality assurance, and feature propriety XTC (Xtreme Thermal Convection) and Reaper HPC heatspreaders for more effective heat dissipation. Furthermore, each OCZ module is backed by the OCZ Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.
About OCZ Technology Group, Inc.Founded in 2002, San Jose, CA-based OCZ Technology Group, Inc. ("OCZ"), is a leader in the design, manufacturing, and distribution of high performance and reliable Solid State Drives (SSDs) and premium computer components. OCZ has built on its expertise in high-speed memory to become a leader in the SSD market, a technology that competes with traditional rotating magnetic hard disk drives (HDDs). SSDs are faster, more reliable, generate less heat and use significantly less power than the HDDs used in the majority of computers today. In addition to SSD technology, OCZ also offers high performance components for computing devices and systems, including enterprise-class power management products as well as leading-edge computer gaming solutions. For more information, please visit: www.ocztechnology.com. The OCZ Technology Group, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=7439 Forward-Looking Statements Certain statements in this release relate to future events and expectations and as such constitute forward-looking statements involving known and unknown factors that may cause actual results of OCZ Technology Group, Inc. to be different from those expressed or implied in the forward-looking statements. In this context, words such as "will," "would," "expect," "anticipate," "should" or other similar words and phrases often identify forward-looking statements made on behalf of OCZ. It is important to note that actual results of OCZ may differ materially from those described or implied in such forward-looking statements based on a number of factors and uncertainties, including, but not limited to, market acceptance of OCZ's products and OCZ's ability to continually develop enhanced products; adverse changes both in the general macro-economic environment as well as in the industries OCZ serves, including computer manufacturing, traditional and online retailers, information storage, internet search and content providers and computer system integrators; OCZ's ability to efficiently manage material and inventory, including integrated circuit chip costs and freight costs; and OCZ's ability to generate cash from operations, secure external funding for its operations and manage its liquidity needs. Other general economic, business and financing conditions and factors are described in more detail in "Item 1A - Risk Factors" in Part II in OCZ's Annual Report on Form 10-K filed with the SEC on May 20, 2010. The filing is available both at www.sec.gov as well as via OCZ's website at www.ocztechnology.com. OCZ does not undertake to update its forward-looking statements.
CONTACT: OCZ Technology Group, Inc. Ryan M. Petersen, CEO 408-733-8400 The Investor Relations Group Investor Relations: Adam Holdsworth Public Relations: Mike Graff 212-825-3210