Cascade Microtech, Inc. (NASDAQ:CSCD), a worldwide leader in the precise electrical and mechanical measurement and test of integrated circuits (ICs) and other small structures and SUSS MicroTec AG (FWB:SMH)(GER:SMH)(ISIN: DE0007226706), a leading supplier of equipment and process solutions for the semiconductor industry and related markets announced today that they have entered into a strategic partnership to address the growing device complexities of emerging semiconductor technologies such as 3D TSV manufacturing and test.

Over the last few decades Moore’s Law (the doubling of device performance every two years) has enabled the semiconductor companies to increase speed, functionality and complexity while reducing cost at the same time. As companies are driving beyond 32 nm, the cost position becomes less favorable and interconnect technology is limiting performance gains. Emerging 3D methodologies (the stacking of one die or wafer on top of another) are addressing these dilemmas. Adoption of 3D TSV (Through-Silicon Via) is the ultimate in 3D integration providing higher performance, reduced noise, smaller device form factor, and modularity in construction at potentially lower cost.

By forming a strategic alliance, the two companies will bring innovative approaches to the 3D TSV manufacturing processes. Both companies will use their associations with leading research organizations such as IMEC, as well as industry partnerships, to gain insight into this cutting-edge methodology driving beyond Moore’s Law. Further collaboration with device and reliability experts will allow the alliance to address the complexities and interactions of semiconductor bonding and test probing for next-generation semiconductor devices.

"SUSS MicroTec shares Cascade Microtech’s commitment to develop the most advanced technologies for the continued improvement of semiconductor technologies," said Frank P. Averdung, President and CEO of SUSS MicroTec AG. "The comprehensive knowledge of the two companies will enable both companies to better address the issues inherent in 3D Integration."

"This joint research initiative with SUSS MicroTec reinforces Cascade Microtech’s commitment to develop practical solutions for leading-edge technologies that increasingly rely on new structures for continued performance improvement," said F. Paul Carlson, Chairman and CEO of Cascade Microtech, Inc. "We look forward to collaborating with SUSS MicroTec on innovative ways to characterize and evaluate new design methodologies and manufacturing processes, which will benefit our common customers, as well as the industries we serve."

About SUSS MicroTec AG

SUSS MicroTec is a leading supplier of equipment and process solutions for markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership. SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany.

For more information, please visit http://www.suss.com

About Cascade Microtech, Inc.

Cascade Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in the precise electrical and mechanical measurement and test of integrated circuits (ICs) and other small structures. For technology businesses and scientific institutions that need to evaluate small structures, Cascade Microtech delivers access to electrical data from wafers, integrated circuits (ICs), IC packages, circuit boards and modules, MEMS, biological structures, 3D TSV, LED devices and more. Cascade Microtech’s leading-edge semiconductor production test products include unique probe cards and test sockets that reduce manufacturing costs of high-speed and high-density semiconductor chips.

For more information visit www.cascademicrotech.com.

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