Orbotech Ltd (ORBK)

33.39
0.54 1.64
NASDAQ : Technology
Prev Close 32.85
Open 32.98
Day Low/High 32.72 / 33.54
52 Wk Low/High 14.70 / 28.97
Volume 223.92K
Avg Volume 447.10K
Exchange NASDAQ
Shares Outstanding 47.90M
Market Cap 1.59B
EPS 1.30
P/E Ratio 19.64
Div & Yield N.A. (N.A)

Latest News

Orbotech Announces $24M Order From Flat Panel Display Manufacturer CHOT

By end of Q2 2017, Orbotech's FPD bookings are expected to reach approximately $300M for the trailing 12 months

Trader's Daily Notebook: As Long Weekend Nears, Volume Will Stay Low

Trader's Daily Notebook: As Long Weekend Nears, Volume Will Stay Low

If you want to stay active, you'll have to do more homework.

EQUITY ALERT: Rosen Law Firm Announces Investigation Of Securities Claims Against Orbotech Ltd.

Rosen Law Firm, a global investor rights law firm, announces it is investigating potential securities claims on behalf of shareholders of Orbotech Ltd.

Tianma Selects Orbotech Solutions For Its Flex AMOLED Gen 6 Fab

Chinese FPD manufacturer will implement Orbotech's AOI and ArrayChecker™ solutions to optimize quality, throughput and process efficiency for Flex AMOLED displays

Orbotech's SPTS Technologies Accelerates Industry Adoption Of Its Mosaic Plasma Dicing Solution With Order From JCAP Corporation

Industry Adoption of SPTS's Plasma Dicing Solution Further Verified by System Plus Consulting 'Teardown' Analysis of MEMS Microphones in iPhone 7 Plus

Orbotech's Solutions Selected By BOE For World's First Gen 10.5 FPD Fab

Orbotech's Solutions Selected By BOE For World's First Gen 10.5 FPD Fab

Chinese Manufacturer BOE to Optimize Production with Orbotech Technologies

Orbotech's Emerald™ Laser Via Formation Solution Selected By Huatian For 3D Wafer-Level Packaging Applications

Orbotech's Emerald™ Laser Via Formation Solution Selected By Huatian For 3D Wafer-Level Packaging Applications

High Accuracy Laser Drilling of Via Holes offers High Quality, Cost Efficient Process Solution for CMOS Image Sensors

Orbotech Inkjet™ 600 Selected By Amkor Technology For System-in-Package Applications

Orbotech Inkjet™ 600 Selected By Amkor Technology For System-in-Package Applications

High Accuracy Inkjet Printing of 3D Underfill Dams Offers Greater Flexibility and Lower Cost of Ownership in Volume Production

Orbotech Ltd. Announces Strategic Capital Market Transactions To Enhance Balance Sheet Flexibility

Orbotech Ltd. Announces Strategic Capital Market Transactions To Enhance Balance Sheet Flexibility

- Proceeds from new $110 million UK term debt facility and recent share offering to be used to retire the balance of the Company's 2014 Credit Agreement

Orbotech (ORBK) Stock Higher, Barclays Raises Price Target

Orbotech (ORBK) Stock Higher, Barclays Raises Price Target

Shares of Orbotech (ORBK) are rising late Wednesday afternoon as Barclays increased its price target on the stock following last week's meetings with company management.

Orbotech's New Nuvogo™ Direct Imaging Systems For Advanced HDI, Including MSAP Production Process

Orbotech's New Nuvogo™ Direct Imaging Systems For Advanced HDI, Including MSAP Production Process

The Nuvogo™ Fine targets a new PCB manufacturing industry standard for Advanced HDI and Flexible PCB Production of thinner devices

Orbotech Launches Precise™ 800, A Groundbreaking Automated Optical Shaping (AOS) Solution To Increase PCB Yield

Orbotech Launches Precise™ 800, A Groundbreaking Automated Optical Shaping (AOS) Solution To Increase PCB Yield

The Precise™ 800 is a unique innovative implementation of digital additive manufacturing, enabling 3D Shaping of shorts and opens for Advanced HDI and Complex Multi-Layer PCBs

Weak On High Volume: Orbotech (ORBK)

Weak On High Volume: Orbotech (ORBK)

Trade-Ideas LLC identified Orbotech (ORBK) as a weak on high relative volume candidate

Orbotech's SPTS Division Receives Repeat Order For Sigma FxP PVD Systems From Huatian Technology For 300mm Wafer Level Packaging Applications

Orbotech's SPTS Division Receives Repeat Order For Sigma FxP PVD Systems From Huatian Technology For 300mm Wafer Level Packaging Applications

SPTS Technologies' PVD Solutions to Enable Expansion of Huatian's 300mm Bumping Line and Packaging Capabilities

Orbotech's SPTS Technologies Receives Repeat Order From JCAP Corporation For Sigma FxP PVD Systems

Orbotech's SPTS Technologies Receives Repeat Order From JCAP Corporation For Sigma FxP PVD Systems

One of China's Leading Advanced Packaging Providers Selects SPTS PVD Solution to Expand its 300mm Bumping Capacity

Orbotech Collaborates With Nippon Mektron To Optimize Digital Flexible Printed Circuit Board Manufacturing

Orbotech Collaborates With Nippon Mektron To Optimize Digital Flexible Printed Circuit Board Manufacturing

Orbotech's fully digital direct imaging and automated optical inspection systems will ensure consistent quality and fast production ramp-up for smartphone manufacturing

Orbotech To Supply Seven UV Laser Drilling Systems To A Leading Japanese Electronic Materials And Components Manufacturer

Orbotech To Supply Seven UV Laser Drilling Systems To A Leading Japanese Electronic Materials And Components Manufacturer

Follow-on customer order confirms the Emerald™ Series UV Laser Drilling systems' ability to facilitate fast and accurate mass production of ceramic substrates

Orbotech Announces SPTS Technologies Has Installed A 300mm MEMS Vapor HF Etch Release Solution At CEA-Leti

Orbotech Announces SPTS Technologies Has Installed A 300mm MEMS Vapor HF Etch Release Solution At CEA-Leti

SPTS' New Monarch 300 Vapor HF Etch Release Solution to Enable a New Family of NEMS and MEMS Technologies at Prominent European Research Institute

Orbotech Receives $57 Million In Orders From A Leading Semiconductor Manufacturing Company To Support Fan-Out Wafer Level Packaging Production

Orbotech Receives $57 Million In Orders From A Leading Semiconductor Manufacturing Company To Support Fan-Out Wafer Level Packaging Production

SPTS Extends its Lead as the Supplier of Choice for the Fastest Growing Format with Multiple Sigma fxP PVD Systems Orders